12-ps ECL using low-base-resistance Si bipolar transistor by self-aligned metal/IDP technology

1997 ◽  
Vol 44 (12) ◽  
pp. 2207-2212 ◽  
Author(s):  
T. Onai ◽  
E. Ohue ◽  
M. Tanabe ◽  
K. Washio
Author(s):  
Fan Ren ◽  
Cammy R. Abernathy ◽  
J. M. Van Hove ◽  
P. P. Chow ◽  
R. Hickman ◽  
...  

A GaN/AlGaN heterojunction bipolar transistor has been fabricated using Cl2/Ar dry etching for mesa formation. As the hole concentration increases due to more efficient ionization of the Mg acceptors at elevated temperatures (> 250°C), the device shows improved gain. Future efforts should focus on methods for reducing base resistance, which are briefly summarized.


2000 ◽  
Vol 39 (Part 1, No. 4B) ◽  
pp. 1987-1991 ◽  
Author(s):  
Yukihiro Kiyota ◽  
Toshiyuki Kikuchi ◽  
Katsuyoshi Washio ◽  
Taroh Inada

1988 ◽  
Vol 49 (C4) ◽  
pp. C4-579-C4-582
Author(s):  
J. G. METCALFE ◽  
R. C. HAYES ◽  
A. J. HOLDEN ◽  
A. P. LONG

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