Simulation aided hardening of N-channel power MOSFETs to prevent single event burnout

1995 ◽  
Vol 42 (6) ◽  
pp. 1935-1939 ◽  
Author(s):  
C. Dachs ◽  
F. Roubaud ◽  
J.-M. Palau ◽  
G. Bruguier ◽  
J. Gasiot ◽  
...  
1996 ◽  
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G.H. Johnson ◽  
K.F. Galloway ◽  
R.D. Schrimpf ◽  
J.L. Titus ◽  
C.F. Wheatley ◽  
...  

1992 ◽  
Vol 39 (6) ◽  
pp. 1605-1612 ◽  
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G.H. Johnson ◽  
R.D. Schrimpf ◽  
K.F. Galloway ◽  
R. Koga

1993 ◽  
Vol 40 (6) ◽  
pp. 1952-1958 ◽  
Author(s):  
F. Roubaud ◽  
C. Dachs ◽  
J.-M. Palau ◽  
J. Gasiot ◽  
P. Tastet

1992 ◽  
Vol 39 (6) ◽  
pp. 1698-1703 ◽  
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S. Kuboyama ◽  
S. Matsuda ◽  
T. Kanno ◽  
T. Ishii

2021 ◽  
Author(s):  
Chao Peng ◽  
Zhifeng Lei ◽  
Ziwen Chen ◽  
Shaozhong Yue ◽  
Zhangang Zhang ◽  
...  

2019 ◽  
Vol 963 ◽  
pp. 738-741
Author(s):  
Hiroshi Kono ◽  
Teruyuki Ohashi ◽  
Takao Noda ◽  
Kenya Sano

Neutron single event effect (SEE) tolerance of SiC power MOSFETs with different drift region design were evaluated. The SEE is detected over the SEE threshold voltage (VSEE). The failure rate increases exponentially as the drain voltage increases above VSEE. The device with higher avalanche breakdown voltage has higher SEE threshold voltage. The neutron SEE tolerance of MOSFETs and PiN diodes of the same epitaxial structure were also evaluated. There was no significant difference in the neutron SEE tolerance of these devices.


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