Грибовидная меза-структура для лавинных фотодиодов на гетероструктурах InAlAs/InGaAs

Mushroom mesa structure for InAlAs/InGaAs avalanche photodiodes (APD) was proposed and investigated. APD heterostructrures were grown by molecular-beam epitaxy. Fabricated APDs with sensitive area diameter of about 30 micron were passivated by SiN deposition and demonstrate avalanche breakdown voltage Vbr ~ 70-80 V. At applied bias of 0.9 Vbr the dark current was ~ 75-200 nA. The single-mode coupled APDs demonstrate responsivity at a gain of unity is high than 0.5A/W at 1550 nm.

Impact of Device Structure on Neutron-Induced Single-Event Effect in SiC MOSFETs

Neutron single event effect (SEE) tolerance of SiC power MOSFETs with different drift region design were evaluated. The SEE is detected over the SEE threshold voltage (VSEE). The failure rate increases exponentially as the drain voltage increases above VSEE. The device with higher avalanche breakdown voltage has higher SEE threshold voltage. The neutron SEE tolerance of MOSFETs and PiN diodes of the same epitaxial structure were also evaluated. There was no significant difference in the neutron SEE tolerance of these devices.

Высоковольтные диффузионные диоды с резким восстановлением. I. Численное моделирование

The operation of diffusion step recovery diodes (dSRD) as current interrupters in high-power nanosecond pulse generators was studied in detail by the methods of numerical computer simulation for the first time. One of the necessary conditions that minimize the loss in dSRD was specified. Dependences of pre-pulse voltage, front duration, amplitude and duration of pulse formed on the active load, and the energy of switching losses in the dSRD on the device area and the break current density are obtained. It is shown that simulation results can be described by simple analytical formulas obtained in the second part of the work, with an accuracy of 10-20% if the pulse amplitude does not exceed the avalanche breakdown voltage of the dSRD. The generalized figure of merit which can be used for optimization of dSRD parameters, a mode of its operation and comparison of efficiency of current interrupters of various types was offered.

Транспорт носителей заряда и перезарядка глубоких уровней в структурах для лавинных S-диодов на основе GaAs

Carrier transport and deep-level recharging in semiconductor avalanche S-diode structures have been investigated. Gallium-arsenide n ^+–π–ν– n structures with the diffusion distribution of deep iron acceptors have been studied. It has been found by solving the continuity and Poisson equations with the use of a commercial software that the electron injection affects the avalanche breakdown voltage and the spacecharge region broadens due to capture of avalanche holes on negative iron ions in the π-region. It is demonstrated by comparing the results of numerical calculation with the experimental data that the S -shaped I–V characteristic of the diffusion avalanche S -diodes cannot be explained within the previously proposed mechanism of capture of avalanche holes on the deep iron levels.

Temperature Dependence Study of Mesa-Type InGaAs/InAlAs Avalanche Photodiode Characteristics

Avalanche photodiodes (APDs) are key optical receivers due to their performance advantages of high speed, high sensitivity, and low noise. The most critical device parameters of APD include the avalanche breakdown voltage and dark current. In this work, we study the temperature dependence of the breakdown voltage and dark current of the mesa-type APD over a wide temperature range of 20–145°C. We institute an empirical model based on impact ionization processes to account for the experimental data. It is shown that highly stable breakdown characteristics of mesa-type APD can be attained with the optimization of the multiplication layer design. We have achieved excellent stability of avalanche breakdown voltage with a temperature coefficient of 0.017 V/°C. The temperature dependence of dark current is attributed to generation-recombination mechanism. The bandgap energy is estimated to be about 0.71 eV based on the temperature variation of dark current, in good agreement with the value for InGaAs.

Improved Analytical Expressions for Avalanche Breakdown in 4H-SiC

A new power law is approximated for effective impact ionization in 4H-SiC, which is then used to generate one-dimensional equations for critical electric field, avalanche breakdown voltage, and depletion layer width that match both simulation and published device results better than previous published equations.

A Novel Truncated V-Groove 4H-SiC MOSFET with High Avalanche Breakdown Voltage and Low Specific on-Resistance

A breakdown of a conventional trench SiC-MOSFET is caused by oxide breakdown at the bottom of the trench. We have fabricated a novel trench SiC-MOSFET with buried p+ regions and demonstrated the high breakdown voltage of 1700 V and the specific on-resistance of 3.5 mΩcm2.

4H-SiC Diode Avalanche Breakdown Voltage Estimation by Simulation and Junction Termination Extension Analysis

This paper presents and compares different avalanche breakdown voltage estimation methods in 4H-SiC (silicon carbide) using finite element simulation results on Schottky diode. 4H-SiC avalanche breakdown voltage and depletion width estimated with Baligas equations have shown to be higher than other estimation techniques and simulation results, especially for voltages higher than 5kV. This paper discusses the impact of choosing different junction termination extension (JTE) structures on two-dimensional junction curvature effects and electric field crowding for Schottky diodes Space-Modulated JTE (SMJTE) structure with optimum JTE dose and dimension could achieve up to 90% of the parallel plane breakdown voltage. For ultra high voltage devices (>15 kV) the SMJTE has significant improvement in terms of breakdown voltage. It also has a wider optimum JTE dose window. For 1 kV device there is not a significant difference in breakdown voltage between JTE and SMJTE structures.