Design of DC-side wiring structure for high-speed switching operation using SiC power devices

Author(s):  
Keiji Wada ◽  
Masato Ando ◽  
Akihiro Hino
2003 ◽  
Vol 764 ◽  
Author(s):  
Sei-Hyung Ryu ◽  
Anant K. Agarwal ◽  
James Richmond ◽  
John W. Palmour

AbstractVery high critical field, reasonable bulk electron mobility, and high thermal conductivity make 4H-Silicon carbide very attractive for high voltage power devices. These advantages make high performance unipolar switching devices with blocking voltages greater than 1 kV possible in 4H-SiC. Several exploratory devices, such as vertical MOSFETs and JFETs, have been reported in SiC. However, most of the previous works were focused on high voltage aspects of the devices, and the high speed switching aspects of the SiC unipolar devices were largely neglected. In this paper, we report on the static and dynamic characteristics of our 4H-SiC DMOSFETs. A simple model of the on-state characteristics of 4H-SiC DMOSFETs is also presented.


Electronics ◽  
2020 ◽  
Vol 9 (12) ◽  
pp. 2007
Author(s):  
Nikita Hari ◽  
Sridhar Ramasamy ◽  
Mominul Ahsan ◽  
Julfikar Haider ◽  
Eduardo M. G. Rodrigues

This paper begins with a comprehensive review into the existing GaN device models. Secondly, it identifies the need for a more accurate GaN switching model. A simple practical process based on radio frequency techniques using Vector Network Analyser is introduced in this paper as an original contribution. It was applied to extract the impedances of the GaN device to develop an efficient behavioural model. The switching behaviour of the model was validated using both simulation and real time double pulse test experiments at 500 V, 15 A conditions. The proposed model is much easier for power designers to handle, without the need for knowledge about the physics or geometry of the device. The proposed model for Transphorm GaN HEMT was found to be 95.2% more accurate when compared to the existing LT-Spice manufacturer model. This work additionally highlights the need to adopt established RF techniques into power electronics to reduce the learning curve while dealing with these novel high-speed switching devices.


Author(s):  
Hiroshi Sato ◽  
Fumiki Kato ◽  
Hiroshi Nakagawa ◽  
Hiroshi Yamaguchi ◽  
Simanjorang Rejeki ◽  
...  

Author(s):  
Atsushi Yao ◽  
Mitsuo Okamoto ◽  
Fumiki Kato ◽  
Hiroshi Hozoji ◽  
Shinji Sato ◽  
...  

2016 ◽  
Vol 858 ◽  
pp. 1057-1060 ◽  
Author(s):  
Konstantin Kostov ◽  
Jang Kwon Lim ◽  
Ya Fan Zhang ◽  
Mietek Bakowski

The package parasitics are a serious obstacle to the high-speed switching, which is necessary in order to reduce the switching power losses or reduce the size of power converters. In order to design new packages suitable for Silicon Carbide (SiC) power transistors, it is necessary to extract the parasitics of different packages and be able to predict the switching performance of the power devices placed in these packages. This paper presents two ways of simulating the switching performance in a half-bridge power module with SiC MOSFETs. The results show that the parasitic inductances in the power module slow down the switching, lead to poor current sharing, and together with the parasitic capacitances lead to oscillations. These negative effects can cause failures, increased losses, and electromagnetic compatibility issues.


2013 ◽  
Vol 133 (12) ◽  
pp. 1186-1192
Author(s):  
Toshihiko Noguchi ◽  
Tomohiro Mizuno ◽  
Munehiro Murata

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