A 77 GHz on-chip strip dipole antenna integrated with balun circuits for automotive radar

This paper describes the analysis and the design of an integrated antenna on 0.13 µm SiGe BICMOS technology. A non-resonant dipole antenna integrated on SiGe is electromagnetically coupled to a radiating element reported on a printed circuit board (PCB) substrate. This integrated solution, also compatible with system in package (SIP) concept, provides significant improvements with respect to direct System On Chip (SoC) integration. The main objective of this SIP antenna lies on the optimization of integrated millimeter wave front-ends modules, considering the immediate antenna environment (especially the lossy substrate and technological dielectric/metallic levels), in order to achieve performances compatible with short range radar specifications at 79–81 GHz. One solution, using a RT/Rogers Duroid 6006 PCB (er = 6, thickness h = 127 µm), is presented, providing a 2.93 dBi gain, and 45% radiation efficiency antenna.

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A 77-GHz antenna and fully integrated radar transceiver in package

International Journal of Microwave and Wireless Technologies ◽

10.1017/s1759078712000049 ◽

2012 ◽

Vol 4 (4) ◽

pp. 447-453 ◽

Cited By ~ 5

Author(s):

A. Fischer ◽

A. Stelzer ◽

L. Maurer

Keyword(s):

Printed Circuit Board ◽

Dipole Antenna ◽

Frequency Multiplier ◽

Circuit Board ◽

Wafer Level ◽

Automotive Radar ◽

Antenna Structure ◽

Large Bandwidth ◽

Folded Dipole ◽

77 Ghz

A 77-GHz–directional folded dipole antenna integrated in an embedded wafer level ball grid array package is presented. For the characterization of the antenna, a frequency multiplier is embedded, which scales the 4.25-GHz input signal up to 76.5 GHz and allows the use of a commercial signal source. The antenna structure is manufactured at the metallic layer, in the fan-out area of the package, and is directly connected to the monolithically integrated transceiver. The gain of the antenna is about 7 dBi, measured over a large bandwidth of about 8 GHz. The combination of the frequency multiplier with a 77-GHz transceiver and the on-package antenna is a promising approach for a system-in-package to future radar modules for automotive radar applications. Such a module avoids 77-GHz transitions to the printed circuit board and hence simplifies the design and manufacturing of the radar sensor significantly.

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Toward a fully integrated automotive radar system-on-chip in 22 nm FD-SOI CMOS

International Journal of Microwave and Wireless Technologies ◽

10.1017/s1759078721000088 ◽

2021 ◽

pp. 1-9

Author(s):

Philipp Ritter

Keyword(s):

Millimeter Wave ◽

Flip Chip ◽

Printed Circuit Board ◽

Digital Signal ◽

Cmos Technology ◽

Radar System ◽

Circuit Board ◽

Processing Unit ◽

Automotive Radar ◽

On Chip

Abstract Next-generation automotive radar sensors are increasingly becoming sensitive to cost and size, which will leverage monolithically integrated radar system-on-Chips (SoC). This article discusses the challenges and the opportunities of the integration of the millimeter-wave frontend along with the digital backend. A 76–81 GHz radar SoC is presented as an evaluation vehicle for an automotive, fully depleted silicon-over-insulator 22 nm CMOS technology. It features a digitally controlled oscillator, 2-millimeter-wave transmit channels and receive channels, an analog base-band with analog-to-digital conversion as well as a digital signal processing unit with on-chip memory. The radar SoC evaluation chip is packaged and flip-chip mounted to a high frequency printed circuit board for functional demonstration and performance evaluation.

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