Low-Cost Wet-Etching Method to Fabricate a Robust THz Tri-Layer Polarizer With a High Extinction Ratio

Author(s):  
Zhe Huang ◽  
Hau Ping Chan ◽  
Emma Pickwell-MacPherson ◽  
Edward P. J. Parrott
2021 ◽  
Vol 487 ◽  
pp. 126798
Author(s):  
Peyman Malekzadeh ◽  
Gholam-Mohammad Parsanasab ◽  
Hamed Nikbakht ◽  
Ezeddin Mohajerani ◽  
Majid Taghavi ◽  
...  

Author(s):  
Tiesong Xu ◽  
Minghui Zhong ◽  
Xiaolin Liang ◽  
Jia Liu ◽  
Bin Yan ◽  
...  

2021 ◽  
Vol 11 (4) ◽  
pp. 1499
Author(s):  
Bingchen Han ◽  
Junyu Xu ◽  
Pengfei Chen ◽  
Rongrong Guo ◽  
Yuanqi Gu ◽  
...  

An all-optical non-inverted parity generator and checker based on semiconductor optical amplifiers (SOAs) are proposed with four-wave mixing (FWM) and cross-gain modulation (XGM) non-linear effects. A 2-bit parity generator and checker using by exclusive NOR (XNOR) and exclusive OR (XOR) gates are implemented by first SOA and second SOA with 10 Gb/s return-to-zero (RZ) code, respectively. The parity and check bits are provided by adjusting the center wavelength of the tunable optical bandpass filter (TOBPF). A saturable absorber (SA) is used to reduce the negative effect of small signal clock (Clk) probe light to improve extinction ratio (ER) and optical signal-to-noise ratio (OSNR). For Pe and Ce (even parity bit and even check bit) without Clk probe light, ER and OSNR still maintain good performance because of the amplified effect of SOA. For Po (odd parity bit), ER and OSNR are improved to 1 dB difference for the original value. For Co (odd check bit), ER is deteriorated by 4 dB without SA, while OSNR is deteriorated by 12 dB. ER and OSNR are improved by about 2 dB for the original value with the SA. This design has the advantages of simple structure and great integration capability and low cost.


Nanoscale ◽  
2019 ◽  
Vol 11 (6) ◽  
pp. 2779-2786 ◽  
Author(s):  
Jing Li ◽  
Santiago Orrego ◽  
Junjie Pan ◽  
Peisheng He ◽  
Sung Hoon Kang

We report a facile sacrificial casting–etching method to synthesize nanoporous carbon nanotube/polymer composites for ultra-sensitive and low-cost piezoresistive pressure sensors.


2012 ◽  
Vol 548 ◽  
pp. 254-257 ◽  
Author(s):  
Yan He ◽  
Bai Ling Huang ◽  
Yong Lai Zhang ◽  
Li Gang Niu

In this paper, a simple and facile technique for manufacturing glass-based microfluidic chips was developed. Instead of using expensive dry etching technology, the standard UV lithography and wet chemical etching technique was used to fabricate microchannels on a K9 glass substrate. The fabrication process of microfluidic chip including vacuum evaporation, annealing, lithography, and BHF (HF-NH4F-H2O) wet etching were investigated. Through series experiments, we found that anneal was the critical factor for chip quality. As a representative example, a microfluidic channel with 20 m of depth, and 80 m of width was successfully prepared, and the channel surfaces are quite smooth. These results present a simple, low cost, flexible and easy way to fabricate glass-based microfluidic chips.


2013 ◽  
Vol 5 (4) ◽  
pp. 1501406-1501406 ◽  
Author(s):  
A. R. EL-Damak ◽  
Jianhua Chang ◽  
Jian Sun ◽  
Changqing Xu ◽  
Xijia Gu

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