In this work, we present a rapid, low temperature process for the bonding of silicon to steel through the use of inductive heating for MEMS sensor applications. The bonding process takes as short as three seconds with a maximum bonding temperature as low as 230°C at the steel surface. The bonding strength is strong, and causes minimal damage to steel. The process has also been shown to work using leaded and leadfree bonding solder with minimal surface preparation to the steel. Four characterization experiments – tensile and compressive 4-point bend, axial extension, and fatigue tests – have been performed to validate the bonding process and materials. As such, this work illustrates the promise of applying inductive heating for the rapid silicon bonding to steel components for MEMS sensing applications.
Fall Detection Monitoring System Based on MEMS Sensor
