Combined process for wafer direct bonding by means of the surface activation method

2004 ◽  
Author(s):  
T. Suga ◽  
T.H. Kim ◽  
M.M.R. Howlader
Keyword(s):  
Activation Method ◽  
Surface Activation ◽  
Combined Process ◽  
Wafer Direct Bonding

A New Tailored UV Based Surface Activation Method for Bonding to Thermoplastics

2019 ◽  
Author(s):  
Sina Chaeichian ◽  
Kaspar Schaerer ◽  
Ruairi O’Kane ◽  
Michael Halbasch
Keyword(s):  
Activation Method ◽  
Surface Activation

SiC wafer bonding using surface activation method for power device

2017 ◽  
Author(s):  
Fengwen Mu ◽  
Masahisa Fujino ◽  
Tadatomo Suga ◽  
Kenichi Iguchi ◽  
Haruo Nakazawa ◽  
...  
Keyword(s):  
Wafer Bonding ◽  
Activation Method ◽  
Power Device ◽  
Surface Activation ◽  
Sic Wafer

Low-temperature direct bonding of silicon and silicon dioxide by the surface activation method

1998 ◽  
Vol 70 (1-2) ◽  
pp. 164-170 ◽  
Author(s):  
Hideki Takagi ◽  
Ryutaro Maeda ◽  
Teak Ryong Chung ◽  
Tadatomo Suga
Keyword(s):  
Low Temperature ◽  
Silicon Dioxide ◽  
Activation Method ◽  
Surface Activation

Room-Temperature Wafer Direct Bonding Using Ne-Beam Surface-Activation

2014 ◽  
Vol 64 (5) ◽  
pp. 69-75 ◽  
Author(s):  
H. Takagi ◽  
Y. Kurashima ◽  
A. Maeda
Keyword(s):  
Room Temperature ◽  
Surface Activation ◽  
Beam Surface ◽  
Wafer Direct Bonding

Use of the surface activation method in investigating the service properties of compressor oils

1978 ◽  
Vol 14 (10) ◽  
pp. 949-952
Author(s):  
I. N. Garbar ◽  
A. G. Marufenko ◽  
E. S. Pogorelov ◽  
Yu. L. Smertyak ◽  
S. A. Zakharov
Keyword(s):  
Activation Method ◽  
Surface Activation ◽  
Service Properties
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