Vapor-Assisted Surface Activation Method for Homo- and Heterogeneous Bonding of Cu, SiO2, and Polyimide at 150°C and Atmospheric Pressure

2012 ◽  
Vol 41 (8) ◽  
pp. 2274-2280 ◽  
Author(s):  
Akitsu Shigetou ◽  
Tadatomo Suga
Keyword(s):  
Atmospheric Pressure ◽  
Activation Method ◽  
Surface Activation

A New Tailored UV Based Surface Activation Method for Bonding to Thermoplastics

2019 ◽  
Author(s):  
Sina Chaeichian ◽  
Kaspar Schaerer ◽  
Ruairi O’Kane ◽  
Michael Halbasch
Keyword(s):  
Activation Method ◽  
Surface Activation

SiC wafer bonding using surface activation method for power device

2017 ◽  
Author(s):  
Fengwen Mu ◽  
Masahisa Fujino ◽  
Tadatomo Suga ◽  
Kenichi Iguchi ◽  
Haruo Nakazawa ◽  
...  
Keyword(s):  
Wafer Bonding ◽  
Activation Method ◽  
Power Device ◽  
Surface Activation ◽  
Sic Wafer

Low-temperature direct bonding of silicon and silicon dioxide by the surface activation method

1998 ◽  
Vol 70 (1-2) ◽  
pp. 164-170 ◽  
Author(s):  
Hideki Takagi ◽  
Ryutaro Maeda ◽  
Teak Ryong Chung ◽  
Tadatomo Suga
Keyword(s):  
Low Temperature ◽  
Silicon Dioxide ◽  
Activation Method ◽  
Surface Activation

Use of the surface activation method in investigating the service properties of compressor oils

1978 ◽  
Vol 14 (10) ◽  
pp. 949-952
Author(s):  
I. N. Garbar ◽  
A. G. Marufenko ◽  
E. S. Pogorelov ◽  
Yu. L. Smertyak ◽  
S. A. Zakharov
Keyword(s):  
Activation Method ◽  
Surface Activation ◽  
Service Properties
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