Impact of Lead Free Solder Joint Orientation on Multi-terminal Passive Components During FCBGA Board Level Reliability

Influence of Substrate Surface Finish Metallurgy on Lead-Free Solder Joint Microstructure with Implications for Board-Level Reliability

Journal of Electronic Materials ◽

10.1007/s11664-020-08013-0 ◽

2020 ◽

Vol 49 (5) ◽

pp. 3251-3258

Author(s):

Marion Branch Kelly ◽

Tapabrata Maity ◽

A. R. Nazmus Sakib ◽

D. R. Frear ◽

Nikhilesh Chawla

Keyword(s):

Solder Joint ◽

Substrate Surface ◽

Lead Free ◽

Lead Free Solder ◽

Joint Microstructure ◽

Solder Joint Microstructure ◽

Influence Of Substrate ◽

Free Solder ◽

Board Level ◽

Correction to: Influence of Substrate Surface Finish Metallurgy on Lead-Free Solder Joint Microstructure with Implications for Board-Level Reliability

Journal of Electronic Materials ◽

10.1007/s11664-020-08156-0 ◽

2020 ◽

Vol 49 (7) ◽

pp. 4466-4467

Author(s):

Marion Branch Kelly ◽

Tapabrata Maity ◽

A. R. Nazmus Sakib ◽

D. R. Frear ◽

Nikhilesh Chawla

Keyword(s):

Solder Joint ◽

Substrate Surface ◽

Lead Free ◽

Lead Free Solder ◽

Joint Microstructure ◽

Solder Joint Microstructure ◽

Influence Of Substrate ◽

Free Solder ◽

Board Level ◽

A study of board level reliability test with bump structure of WLCSP lead-free solder joints

2007 International Microsystems, Packaging, Assembly and Circuits Technology ◽

10.1109/impact.2007.4433627 ◽

2007 ◽

Cited By ~ 6

Author(s):

Frank Kao ◽

Zhi Hao Tseng ◽

Chun Sheng Ho ◽

Stan Chen ◽

Chang-Yi Lan ◽

...

Keyword(s):

Solder Joints ◽

Lead Free ◽

Reliability Test ◽

Lead Free Solder ◽

Free Solder ◽

Board Level ◽

2014 Joint IEEE International Symposium on the Applications of Ferroelectric, International Workshop on Acoustic Transduction Materials and Devices & Workshop on Piezoresponse Force Microscopy ◽

Low silver lead-free solder joint reliability of VFBGA packages under board level drop test at −45°C

10.1109/isaf.2014.6917970 ◽

2014 ◽

Author(s):

Xiaoyan Niu ◽

Zhanbiao Zhang ◽

Guixiang Wang ◽

Xuefeng Shu

Keyword(s):

Solder Joint ◽

Drop Test ◽

Lead Free ◽

Lead Free Solder ◽

Joint Reliability ◽

Free Solder ◽

Modeling of board level solder joint reliability under mechanical drop test with the consideration of plastic strain hardening of lead-free solder

2010 IEEE CPMT Symposium Japan ◽

10.1109/cpmtsympj.2010.5679663 ◽

2010 ◽

Cited By ~ 1

Author(s):

Z. J. Xu ◽

T. Jiang ◽

F. B. Song ◽

Jeffery C. C. Lo ◽

S. W. Ricky Lee

Keyword(s):

Plastic Strain ◽

Solder Joint ◽

Strain Hardening ◽

Drop Test ◽

Lead Free ◽

Lead Free Solder ◽

Joint Reliability ◽

Free Solder ◽

Low silver lead-free solder joint reliability of VFBGA packages under board level drop test at −45°C

2014 15th International Conference on Electronic Packaging Technology ◽

10.1109/icept.2014.6922761 ◽

2014 ◽

Cited By ~ 1

Author(s):

Xiaoyan Niu ◽

Zhanbiao Zhang ◽

Guixiang Wang ◽

Xuefeng Shu

Keyword(s):

Solder Joint ◽

Drop Test ◽

Lead Free ◽

Lead Free Solder ◽

Joint Reliability ◽

Free Solder ◽

Board-Level Reliability of Lead-Free Solder under Mechanical Shock and Vibration Loads

Structural Dynamics of Electronic and Photonic Systems ◽

10.1002/9780470950012.ch17 ◽

2011 ◽

pp. 371-413 ◽

Cited By ~ 2

Author(s):

Toni T. Matilla ◽

Pekka Marjamaki ◽

Jorma Kivilahti

Keyword(s):

Lead Free ◽

Lead Free Solder ◽

Mechanical Shock ◽

Vibration Loads ◽

Free Solder ◽

Board Level ◽

Experimental and numerical analysis of BGA lead-free solder joint reliability under board-level drop impact

Microelectronics Reliability ◽

10.1016/j.microrel.2008.10.014 ◽

2009 ◽

Vol 49 (1) ◽

pp. 79-85 ◽

Cited By ~ 22

Author(s):

Fang Liu ◽

Guang Meng ◽

Mei Zhao ◽

Jun feng Zhao

Keyword(s):

Numerical Analysis ◽

Solder Joint ◽

Drop Impact ◽

Lead Free ◽

Lead Free Solder ◽

Joint Reliability ◽

Free Solder ◽

Board Level Reliability assessment of Wafer Level Chip Scale Packages for SACQ, a lead-free solder with a novel life prediction model

2018 7th Electronic System-Integration Technology Conference (ESTC) ◽

10.1109/estc.2018.8546504 ◽

2018 ◽

Author(s):

Balaji Nandhivaram Muthuraman ◽

Baltazar Canete

Keyword(s):

Prediction Model ◽

Life Prediction ◽

Reliability Assessment ◽

Lead Free ◽

Lead Free Solder ◽

Wafer Level ◽

Free Solder ◽

Board Level ◽

Board Level Reliability ◽

Life Prediction Model

Impact of lead free solder materials on board level reliability for low-K WLCSP

2007 International Microsystems, Packaging, Assembly and Circuits Technology ◽

10.1109/impact.2007.4433608 ◽

2007 ◽

Cited By ~ 4

Author(s):

K. M. Chen ◽

K. K. Ho ◽

D. S. Jiang

Keyword(s):

Lead Free ◽

Lead Free Solder ◽

Free Solder ◽

Board Level ◽

Board Level Reliability ◽

Low K