A study of board level reliability test with bump structure of WLCSP lead-free solder joints

2007 International Microsystems, Packaging, Assembly and Circuits Technology ◽

10.1109/impact.2007.4433627 ◽

2007 ◽

Cited By ~ 6

Author(s):

Frank Kao ◽

Zhi Hao Tseng ◽

Chun Sheng Ho ◽

Stan Chen ◽

Chang-Yi Lan ◽

...

Keyword(s):

Solder Joints ◽

Lead Free ◽

Reliability Test ◽

Lead Free Solder ◽

Free Solder ◽

Board Level ◽

Board Level Reliability

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Influence of Substrate Surface Finish Metallurgy on Lead-Free Solder Joint Microstructure with Implications for Board-Level Reliability

Journal of Electronic Materials ◽

10.1007/s11664-020-08013-0 ◽

2020 ◽

Vol 49 (5) ◽

pp. 3251-3258

Author(s):

Marion Branch Kelly ◽

Tapabrata Maity ◽

A. R. Nazmus Sakib ◽

D. R. Frear ◽

Nikhilesh Chawla

Keyword(s):

Solder Joint ◽

Substrate Surface ◽

Lead Free ◽

Lead Free Solder ◽

Joint Microstructure ◽

Solder Joint Microstructure ◽

Influence Of Substrate ◽

Free Solder ◽

Board Level ◽

Board Level Reliability

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Comprehensive Modeling of Stress-Strain Behavior for Lead-Free Solder Joints under Board-Level Drop Impact Loading Condition

2007 Proceedings 57th Electronic Components and Technology Conference ◽

10.1109/ectc.2007.373847 ◽

2007 ◽

Cited By ~ 14

Author(s):

F.X. Che ◽

John H.L. Pang ◽

W.H. Zhu ◽

Wei Sun ◽

Anthony Sun ◽

...

Keyword(s):

Impact Loading ◽

Loading Condition ◽

Solder Joints ◽

Lead Free ◽

Lead Free Solder ◽

Stress Strain ◽

Strain Behavior ◽

Free Solder ◽

Board Level ◽

Comprehensive Modeling

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Board-Level Reliability of Lead-Free Solder under Mechanical Shock and Vibration Loads

Structural Dynamics of Electronic and Photonic Systems ◽

10.1002/9780470950012.ch17 ◽

2011 ◽

pp. 371-413 ◽

Cited By ~ 2

Author(s):

Toni T. Matilla ◽

Pekka Marjamaki ◽

Jorma Kivilahti

Keyword(s):

Lead Free ◽

Lead Free Solder ◽

Mechanical Shock ◽

Vibration Loads ◽

Free Solder ◽

Board Level ◽

Board Level Reliability

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Board Level Reliability assessment of Wafer Level Chip Scale Packages for SACQ, a lead-free solder with a novel life prediction model

2018 7th Electronic System-Integration Technology Conference (ESTC) ◽

10.1109/estc.2018.8546504 ◽

2018 ◽

Author(s):

Balaji Nandhivaram Muthuraman ◽

Baltazar Canete

Keyword(s):

Prediction Model ◽

Life Prediction ◽

Reliability Assessment ◽

Lead Free ◽

Lead Free Solder ◽

Wafer Level ◽

Free Solder ◽

Board Level ◽

Board Level Reliability ◽

Life Prediction Model

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Correction to: Influence of Substrate Surface Finish Metallurgy on Lead-Free Solder Joint Microstructure with Implications for Board-Level Reliability

Journal of Electronic Materials ◽

10.1007/s11664-020-08156-0 ◽

2020 ◽

Vol 49 (7) ◽

pp. 4466-4467

Author(s):

Marion Branch Kelly ◽

Tapabrata Maity ◽

A. R. Nazmus Sakib ◽

D. R. Frear ◽

Nikhilesh Chawla

Keyword(s):

Solder Joint ◽

Substrate Surface ◽

Lead Free ◽

Lead Free Solder ◽

Joint Microstructure ◽

Solder Joint Microstructure ◽

Influence Of Substrate ◽

Free Solder ◽

Board Level ◽

Board Level Reliability

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Impact of lead free solder materials on board level reliability for low-K WLCSP

2007 International Microsystems, Packaging, Assembly and Circuits Technology ◽

10.1109/impact.2007.4433608 ◽

2007 ◽

Cited By ~ 4

Author(s):

K. M. Chen ◽

K. K. Ho ◽

D. S. Jiang

Keyword(s):

Lead Free ◽

Lead Free Solder ◽

Free Solder ◽

Board Level ◽

Board Level Reliability ◽

Low K

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Reliability test and IMC investigation of lead and lead free solder joints on different surface finish processes

2009 4th International Microsystems, Packaging, Assembly and Circuits Technology Conference ◽

10.1109/impact.2009.5382266 ◽

2009 ◽

Author(s):

Yun Peng Ho ◽

Jen Tsung Luo ◽

Keven Hsu ◽

Arthur Chen

Keyword(s):

Surface Finish ◽

Solder Joints ◽

Lead Free ◽

Reliability Test ◽

Lead Free Solder ◽

Free Solder

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Lead-Free Solder Material and Chip Thickness Impact on Board-Level Reliability for Low-K WLCSP

IEEE Transactions on Advanced Packaging ◽

10.1109/tadvp.2009.2036153 ◽

2010 ◽

Vol 33 (2) ◽

pp. 340-347 ◽

Cited By ~ 10

Author(s):

K M Chen

Keyword(s):

Chip Thickness ◽

Lead Free ◽

Lead Free Solder ◽

Solder Material ◽

Free Solder ◽

Board Level ◽

Board Level Reliability ◽

Low K

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Impact of Lead Free Solder Joint Orientation on Multi-terminal Passive Components During FCBGA Board Level Reliability

2016 IEEE 66th Electronic Components and Technology Conference (ECTC) ◽

10.1109/ectc.2016.108 ◽

2016 ◽

Cited By ~ 2

Author(s):

Jaimal M. Williamson ◽

Gregory T. Ostrowicki ◽

Vikas Gupta ◽

Siva P. Gurrum ◽

Andy Zhang

Keyword(s):

Solder Joint ◽

Lead Free ◽

Lead Free Solder ◽

Joint Orientation ◽

Passive Components ◽

Free Solder ◽

Board Level ◽

Board Level Reliability

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Board level reliability testing of μBGA/sup (R)/ packaging with lead-free solder attachment

Proceedings of 3rd Electronics Packaging Technology Conference (EPTC 2000) (Cat. No.00EX456) ◽

10.1109/eptc.2000.906342 ◽

2002 ◽

Author(s):

V. Solberg

Keyword(s):

Lead Free ◽

Lead Free Solder ◽

Reliability Testing ◽

Free Solder ◽

Board Level ◽

Board Level Reliability

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