Use of Digital Signal Characteristics for Solder Joint Failure Precursors

2016 ◽  
Author(s):  
Jinwoo Lee ◽  
Daeil Kwon
Keyword(s):  
Solder Joint ◽  
Digital Signal ◽  
Joint Failure ◽  
Signal Characteristics ◽  
Failure Precursors

Structural improvement for solder joint failure in ultrasonic plastic assembly

2008 ◽  
Vol 16 (7) ◽  
pp. 848-857
Author(s):  
Jie Shen ◽  
XianLong Jin
Keyword(s):  
Solder Joint ◽  
Joint Failure ◽  
Structural Improvement

Experimental Investigation by Speckle Interferometry of Solder Joint Failure Under Thermomechanical Load Aggravated by Boundary Conditions at Board Level

2012 ◽  
Vol 134 (4) ◽  
Author(s):  
D. N. Borza ◽  
I. T. Nistea
Keyword(s):  
Solder Joint ◽  
Fundamental Frequency ◽  
Printed Circuit Board ◽  
Speckle Interferometry ◽  
Circuit Board ◽  
Joint Failure ◽  
Printed Circuit ◽  
Out Of Plane ◽  
Fringe Patterns ◽  
Board Level

Reliability of electronic assemblies at board level and solder joint integrity depend upon the stress applied to the assembly. The stress is often of thermomechanical or of vibrational nature. In both cases, the behavior of the assembly is strongly influenced by the mechanical boundary conditions created by the printed circuit board (PCB) to casing fasteners. In many previously published papers, the conditions imposed to the fasteners are mostly aiming at an increase of the fundamental frequency and a decrease of static or dynamic displacement values characterizing the deformation. These conditions aim at reducing the fatigue in different parts of these assemblies. In the photomechanics laboratory of INSA Rouen, the origins of solder joint failure have been investigated by means of full-field measurements of the flexure deformation induced by vibrations or by forced thermal convection. The measurements were done both at a global level for the whole printed circuit board assembly (PCBA) and at a local level at the solder joints where failure was reported. The experimental technique used was phase-stepped laser speckle interferometry. This technique has a submicrometer sensitivity with respect to out-of-plane deformations induced by bending and its use is completely nonintrusive. Some of the results were comforted by comparison with a numerical finite elements model. The experimental results are presented either as time-average holographic fringe patterns, as in the case of vibrations, or as wrapped phase patterns, as in the case of deformation under thermomechanical stress. Both types of fringe patterns may be processed so as to obtain the explicit out-of-plane static deformation (or vibration amplitude) maps. Experimental results show that the direct cause of solder joint failure may be a high local PCB curvature produced by a supplementary fastening screw intended to reduce displacements and increase fundamental frequency. The curvature is directly responsible for tensile stress appearing in the leads of a large quad flat pack (QFP) component and for shear in the corresponding solder joints. The general principle of increasing the fundamental frequency and decreasing the static or dynamic displacement values has to be checked against the consequences on the PCB curvature near large electronic devices having high stiffness.

Solder-Joint Reliability of a Radar Processor for Semi-Autonomous Driving Applications

2018 ◽  
Vol 2018 (1) ◽  
pp. 000104-000109
Author(s):  
Mollie Benson ◽  
Burton Carpenter ◽  
Andrew Mawer
Keyword(s):  
Solder Joint ◽  
Thermal Shock ◽  
Surface Finish ◽  
Solder Ball ◽  
Digital Signal ◽  
Autonomous Driving ◽  
Solder Joint Reliability ◽  
Automotive Safety ◽  
Safety Integrity Level ◽  
Joint Reliability

Abstract Radar is currently employed in automotive applications to provide the range, angle, and velocity of objects using RF waves (77GHz). This paper outlines solder joint reliability of a specific micro-processor that processes data received from a SRR (short range radar operating from 0.2 to 30 meters). It is a powerful digital signal processing accelerator, which targets safety applications that require a high Automotive Safety Integrity Level (ASIL-B). The paper explores the package design and construction, SMT (surface mount technology) assembly, and board level reliability testing of various BGA pad surface finish and solder ball alloy materials on a 0.65 mm pitch, 10 × 10 mm body 141 MAPBGA (mold array process-ball grid array) package. The package configurations include two BGA pad surface finishes (Ni/Au and OSP [organic solderability protectant]) and three solder alloys (SnAg, SAC405, and SAC-Bi [a Bi containing SAC derivative]). Solder joint reliability analysis was performed through AATS (air-to-air thermal shock) between 40°C and +125°C and JEDEC Drop Testing at 1500G's. Thermal shock was extended until at least 75% of the populations failed, which was well past the points needed to qualify the packages for the intended end-use applications. The evaluations of the micro-processor indicate that the MAPBGA package can meet the ASIL-B specification requirements with optimized combinations of BGA pad surface finish and solder alloy. The focus of this paper was to determine the baseline solder-joint thermal shock and JEDEC drop performance with varied BGA pad surface finish and solder ball alloy materials.

Investigation on the failure criterion of reliability testing for Pb-free BGA packages

2010 ◽  
Vol 2010 (1) ◽  
pp. 000105-000109
Author(s):  
Weidong Xie ◽  
Tae-Kyu Lee ◽  
Kuo-Chuan Liu ◽  
Jie Xue
Keyword(s):  
Solder Joint ◽  
Failure Criterion ◽  
Reliability Testing ◽  
Threshold Values ◽  
Joint Failure ◽  
Failure Distribution ◽  
Free Solder ◽  
The Impact ◽  
Different Sources ◽  
Over Time

Daisy-chained test vehicles are commonly used in board level reliability testing. By continuously monitoring the in-situ daisy chain resistance change over time, a failure could be captured during cycling and eventually the failure data could be used to establish the solder joints failure distribution under different testing conditions. One of the most debatable matters is that when should one to determine a failure to occur. Per IPC 9701A [1] a failure is defined as 10 1000-ohm events in 1 micro-second duration for event detector or 20% increase over the baseline resistance for data logger. Other threshold values such as 100, 300, or 500 ohms are also commonly used by packaging reliability community. Such a wide range of failure threshold values may introduce significant delta in terms of cycle numbers for Pb-free solder joints if different criteria would be used as reported by Henshall, etc [2]. Therefore a systematic study of the impact of using such diversified resistance values on the final failure distribution is necessary and important such that no big difference among reliability results from different sources. The purpose of this study is to investigate the impact of different failure thresholds on Pb-free solder joint failure distribution for most commonly used packages. The test vehicle, designed on an 8″×15″ double-sided printed circuit board (PCB) with multiple test sites, was populated on both sides with daisy-chained components. To reflect the real situation, the components were selected to include different package types (FCBGA, PBGA, CSP, QFN, etc), different pitches (0.4–1.0 mm), and different package size (6–50mm). The assembled test vehicles then went through 0C–100C thermal cycling, the cycle numbers corresponding to different resistance thresholds were recorded and compared. The test results showed that the failure threshold has significant impact on Pb-free solder joint failure distribution, thus it is important to unify the failure criterion such that the reliability results from different sources could be compared side by side. For some packages especially small wire-bond packages that have relatively low baseline resistance, the 20% failure criterion may be too sensitive to the resistivity changes caused not by solder joint failure but other events such as connection cable resistivity change over time or temperature.

A theoretical model for predicting LED product lifetime based on solder joint failure

2019 ◽  
Author(s):  
Dinusha R. Thotagamuwa ◽  
Nadarajah Narendran ◽  
Yi-Wei Liu ◽  
Xi Mou
Keyword(s):  
Theoretical Model ◽  
Solder Joint ◽  
Joint Failure ◽  
Product Lifetime

Solder joint failure modes in crystalline Si PV modules operated in Tsukuba, Japan for 10 years

2014 ◽  
Author(s):  
Uichi Itoh ◽  
Tetsuro Nishimura ◽  
Takuro Fukami ◽  
Kenji Takamura ◽  
Akira Kita ◽  
...  
Keyword(s):  
Solder Joint ◽  
Failure Modes ◽  
Joint Failure ◽  
Pv Modules

scholarly journals Solder Joint Failure Modes in the Conventional Crystalline Si Module

2014 ◽  
Vol 55 ◽  
pp. 464-468 ◽  
Author(s):  
Uichi Itoh ◽  
Manabu Yoshida ◽  
Hideo Tokuhisa ◽  
Kohichi Takeuchi ◽  
Yasuyuki Takemura
Keyword(s):  
Solder Joint ◽  
Failure Modes ◽  
Joint Failure
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