Novel Piezoelectric Force Sensor Array for Investigation of Ultrasonic Wire Bonding

2020 ◽  
Author(s):  
Matthias Arndt ◽  
Yangyang Long ◽  
Folke Dencker ◽  
Jannik Reimann ◽  
Jens Twiefel ◽  
...  
Keyword(s):  
Sensor Array ◽  
Force Sensor ◽  
Wire Bonding ◽  
Ultrasonic Wire Bonding

ULTRASONIC WIRE BONDING WITH A COMPLEX VIBRATION WELDING TIP

1987 ◽  
pp. 710-715
Author(s):  
Jiromaru TSUJINO ◽  
Masataka KURODA ◽  
Mitsuo HORIKOSHI ◽  
Hidetoshi SUGIMOTO
Keyword(s):  
Wire Bonding ◽  
Vibration Welding ◽  
Ultrasonic Wire Bonding

scholarly journals Transparent and flexible force sensor array based on optical waveguide

2012 ◽  
Vol 20 (13) ◽  
pp. 14486 ◽  
Author(s):  
Youngsung Kim ◽  
Suntak Park ◽  
Seung Koo Park ◽  
Sungryul Yun ◽  
Ki-Uk Kyung ◽  
...  
Keyword(s):  
Optical Waveguide ◽  
Sensor Array ◽  
Force Sensor

Visualization of oxide removal during ultrasonic wire bonding process

2017 ◽  
Author(s):  
Yangyang Long ◽  
Folke Dencker ◽  
Andreas Isaak ◽  
Friedrich Schneider ◽  
Jorg Hermsdorf ◽  
...  
Keyword(s):  
Wire Bonding ◽  
Bonding Process ◽  
Oxide Removal ◽  
Ultrasonic Wire Bonding

Mechanism and Model of Bond Formation in Ultrasonic Wire Bonding

2015 ◽  
Author(s):  
T. Calvin Tszeng
Keyword(s):  
Flip Chip ◽  
Critical Phenomenon ◽  
Bond Formation ◽  
Interfacial Shear Stress ◽  
Wire Bonding ◽  
Micromechanics Model ◽  
Ultrasonic Bonding ◽  
Microelectronic Devices ◽  
Ultrasonic Wire Bonding ◽  
Technological Significance

Despite being a critical phenomenon of tremendous technological significance in ultrasonic flip-chip and wire bonding processes of today’s microelectronic devices, interfacial bond formation still calls for better understanding at a fundamental level. The goal of the research is to improve these processes through better understanding and modeling of bond formation. This paper presents a micromechanics model that addresses increasing contact area during ultrasonic cyclic loading cycle. The micromechanics model provides interfacial shear stress as boundary condition to FEM simulations of ultrasonic bonding processes. Comparison between preliminary results and experimental data is conducted.

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