Multi-Pulse laser ablation modeling with applications to automated zona removal

2015 ◽  
Author(s):  
Christopher Yee Wong ◽  
James K. Mills
Keyword(s):  
Laser Ablation ◽  
Pulse Laser ◽  
Pulse Laser Ablation ◽  
Ablation Modeling

Silicon Thinning using Ultra-Short Pulse Laser Ablation

2004 ◽  
Author(s):  
F. Beaudoin ◽  
P. Perdu ◽  
C. DeNardi ◽  
R. Desplats ◽  
J. Lopez ◽  
...  
Keyword(s):  
Laser Ablation ◽  
Sample Preparation ◽  
Pulse Laser ◽  
Pulse Laser Ablation ◽  
Short Pulse ◽  
Special Care ◽  
Short Pulse Laser ◽  
Ultra Short Pulse ◽  
Ultra Short Pulse Laser

Abstract Ultra-short pulse laser ablation is applied to IC backside sample preparation. It is contact-less, non-thermal, precise and can ablate the various types of material present in IC packages. This study concerns the optimization of ultra-short pulse laser ablation for silicon thinning. Uncontrolled silicon roughness and poor uniformity of the laser thinned cavity needed to be tackled. Special care is taken to minimize the silicon RMS roughness to less than 1µm. Application to sample preparation of 256Mbit devices is presented.

Numerical modeling of ultrashort-pulse laser ablation of silicon

2009 ◽  
Vol 255 (17) ◽  
pp. 7605-7609 ◽  
Author(s):  
D.P. Korfiatis ◽  
K.-A. Th. Thoma ◽  
J.C. Vardaxoglou
Keyword(s):  
Numerical Modeling ◽  
Laser Ablation ◽  
Pulse Laser ◽  
Ultrashort Pulse ◽  
Pulse Laser Ablation ◽  
Ultrashort Pulse Laser

Development of time sequencing and synchronizing electronics for double pulse laser ablation experiments

2013 ◽  
Vol 8 (02) ◽  
pp. P02007-P02007 ◽  
Author(s):  
V Chaudhari ◽  
K Patel ◽  
A Srivastava ◽  
V Sivakumaran ◽  
R K Singh ◽  
...  
Keyword(s):  
Laser Ablation ◽  
Pulse Laser ◽  
Pulse Laser Ablation ◽  
Double Pulse ◽  
Double Pulse Laser
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