Comparison of stress distributions and failure modes during thermal cycling and power cycling on high power IGBT modules
Keyword(s):
Keyword(s):
2018 ◽
Vol 33
(2)
◽
pp. 1075-1086
◽
Keyword(s):
Keyword(s):
2011 ◽
Vol 58
(10)
◽
pp. 4931-4941
◽
Keyword(s):
2012 ◽
Vol 52
(9-10)
◽
pp. 2347-2352
◽