Ageing and Failure Modes of IGBT Modules in High-Temperature Power Cycling
2011 ◽
Vol 58
(10)
◽
pp. 4931-4941
◽
2007 ◽
Vol 47
(9-11)
◽
pp. 1719-1724
◽
2019 ◽
Vol 32
(3)
◽
pp. 306-315
◽
Failure Mechanism of Die-Attach Solder Joints in IGBT Modules Under Pulse High-Current Power Cycling
2019 ◽
Vol 7
(1)
◽
pp. 99-107
◽
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2021 ◽
Keyword(s):