Solid state growth kinetics of complex intermetallics in the Pb-free ball grid array (BGA) solder joint for MEMS packaging

2006 ◽  
Author(s):  
M. Alam ◽  
Yang Dan ◽  
B. Wu ◽  
Y. Chan ◽  
L. Rufer ◽  
...  
Keyword(s):  
Solid State ◽  
Solder Joint ◽  
Growth Kinetics ◽  
Ball Grid Array ◽  
Mems Packaging ◽  
State Growth ◽  
Kinetics Of

Growth Kinetics of IMC Formed between Sn-3.5Ag-0.75Cu BGA Solder and Electroless Ni-P/Cu Substrate by Solid-State Isothermal Aging

2004 ◽  
Vol 449-452 ◽  
pp. 893-896 ◽  
Author(s):  
Jeong Won Yoon ◽  
Chang Bae Lee ◽  
Seung Boo Jung
Keyword(s):  
Solid State ◽  
Growth Kinetics ◽  
Isothermal Aging ◽  
Ball Grid Array ◽  
Cu Substrate ◽  
Diffusion Controlled ◽  
Increasing Temperature ◽  
Electroless Ni ◽  
Kinetics Of ◽  
Deposit Layer

The growth kinetics of intermetallic compound (IMC) layers formed between Sn-3.5Ag-0.75Cu BGA (ball grid array) solder and electroless Ni-P/Cu substrate by solid state isothermal aging were examined at temperatures between 70 and 170°C for 0 to 100 days. In the solder joints between the solder ball and electroless Ni-P/Cu pads, the IMC layer was (Cu,Ni)6Sn5. Also, a P-rich Ni layer formed at the interface between (Cu,Ni)6Sn5 and original Ni-P deposit layer because of the phosphorous accumulation. These IMC layer thicknesses increased linearly with the square root of aging time and the growth was faster for higher aging temperatures. On the contrary, the shear strength decreased with the increasing temperature and time. The growth of IMC layer was mainly controlled by diffusion-controlled mechanism over the temperature range studied. The apparent activation energy calculated for the growth of the (Cu,Ni)6Sn5 IMC was 69.75 kJ/mol.

Growth kinetics of phases in solid-state diffusion couples

1995 ◽  
Vol 152 (2) ◽  
pp. 385-392 ◽  
Author(s):  
V. H. Garcia ◽  
C. Scherer ◽  
P. M. Mors
Keyword(s):  
Solid State ◽  
Growth Kinetics ◽  
Solid State Diffusion ◽  
Diffusion Couples ◽  
State Diffusion ◽  
Kinetics Of

scholarly journals Growth kinetics of solid‐state‐reacted Fe‐Zr multilayer films

1991 ◽  
Vol 70 (9) ◽  
pp. 4870-4876 ◽  
Author(s):  
A. Paesano ◽  
S. R. Teixeira ◽  
L. Amaral
Keyword(s):  
Solid State ◽  
Growth Kinetics ◽  
Multilayer Films ◽  
Kinetics Of

Growth kinetics of intermetallic compounds in chip scale package solder joint

2001 ◽  
Vol 44 (2) ◽  
pp. 317-323 ◽  
Author(s):  
P.L Tu ◽  
Y.C Chan ◽  
K.C Hung ◽  
J.K.L Lai
Keyword(s):  
Solder Joint ◽  
Intermetallic Compounds ◽  
Growth Kinetics ◽  
Chip Scale Package ◽  
Kinetics Of
Sign in / Sign up

Export Citation Format

Share Document