Preparation of wafer-level LED packaging used uniform micro glass cavities by an improved Chemical Foaming Process (CFP)

2013 IEEE 15th Electronics Packaging Technology Conference (EPTC 2013) ◽

10.1109/eptc.2013.6745850 ◽

2013 ◽

Author(s):

Yu Zou ◽

Jintang Shang ◽

Yu Ji ◽

Li Zhang ◽

Chiming Lai ◽

...

Keyword(s):

Wafer Level ◽

Foaming Process ◽

Chemical Foaming

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Chip-on-board (COB) wafer level packaging of LEDs using silicon substrates and chemical foaming process(CFP)-made glass-bubble caps

2011 12th International Conference on Electronic Packaging Technology and High Density Packaging ◽

10.1109/icept.2011.6066806 ◽

2011 ◽

Author(s):

Hui Yu ◽

Jintang Shang ◽

Chao Xu ◽

Xinhu Luo ◽

Jingdong Liu ◽

...

Keyword(s):

Silicon Substrates ◽

Wafer Level ◽

Wafer Level Packaging ◽

Foaming Process ◽

Glass Bubble ◽

Chemical Foaming

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Preparation of wafer-level glass cavities by a low-cost chemical foaming process (CFP)

Lab on a Chip ◽

10.1039/c0lc00708k ◽

2011 ◽

Vol 11 (8) ◽

pp. 1532 ◽

Author(s):

Jintang Shang ◽

Boyin Chen ◽

Wei Lin ◽

Ching-Ping Wong ◽

Di Zhang ◽

...

Keyword(s):

Low Cost ◽

Wafer Level ◽

Foaming Process ◽

Chemical Foaming

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Fabrication of low cost wafer-level micro-lens arrays with spacers using glass molds by combining a Chemical Foaming Process (CFP) and a Hot Forming Process (HFP)

2012 IEEE 62nd Electronic Components and Technology Conference ◽

10.1109/ectc.2012.6248830 ◽

2012 ◽

Author(s):

Shunjin Qin ◽

Jintang Shang ◽

Li Zhang ◽

Tingting Wang ◽

Siyuan Lv ◽

...

Keyword(s):

Low Cost ◽

Hot Forming ◽

Wafer Level ◽

Forming Process ◽

Foaming Process ◽

Chemical Foaming

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Fabrication of wafer-level spherical Rb vapor cells for miniaturized atomic clocks by a chemical foaming process

2012 13th International Conference on Electronic Packaging Technology & High Density Packaging ◽

10.1109/icept-hdp.2012.6474922 ◽

2012 ◽

Author(s):

Wenlong Wei ◽

Jintang Shang ◽

Wenlin Kuai ◽

Shunjin Qin ◽

Tingting Wang ◽

...

Keyword(s):

Atomic Clocks ◽

Wafer Level ◽

Foaming Process ◽

Rb Vapor ◽

Vapor Cells ◽

Chemical Foaming

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Study on volume production of uniform wafer-level micro glass cavities by a chemical foaming process (CFP)

2013 14th International Conference on Electronic Packaging Technology ◽

10.1109/icept.2013.6756565 ◽

2013 ◽

Author(s):

Yu Zou ◽

Jintang Shang ◽

Yu Ji ◽

Li Zhang ◽

Chiming Lai ◽

...

Keyword(s):

Wafer Level ◽

Foaming Process ◽

Volume Production ◽

Chemical Foaming

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Microfabricated low cost wafer-level spherical alkali atom vapor cells for chip-scale atomic clock by a Chemical Foaming Process (CFP)

2013 14th International Conference on Electronic Packaging Technology ◽

10.1109/icept.2013.6756567 ◽

2013 ◽

Author(s):

Youpeng Chen ◽

Jintang Shang ◽

Yu Ji

Keyword(s):

Low Cost ◽

Atomic Clock ◽

Alkali Atom ◽

Wafer Level ◽

Foaming Process ◽

Vapor Cells ◽

Chemical Foaming

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In-situ measurement of internal mold pressure during one-shot chemical foaming process

Seikei-Kakou ◽

10.4325/seikeikakou.29.62 ◽

2017 ◽

Vol 29 (2) ◽

pp. 62-68

Author(s):

Junichiro Tateishi ◽

Norihiko Taniguchi ◽

Tsuyoshi Nishiwaki ◽

Sukumaran Sathish K. ◽

Masataka Sugimoto

Keyword(s):

In Situ Measurement ◽

Internal Mold ◽

Foaming Process ◽

Chemical Foaming

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Fabrication of low cost spherical alkali atom vapor cells by combining a low temperature anodic bonding and a Chemical Foaming Process (CFP)

2013 IEEE 15th Electronics Packaging Technology Conference (EPTC 2013) ◽

10.1109/eptc.2013.6745833 ◽

2013 ◽

Author(s):

Youpeng Chen ◽

Jintang Shang ◽

Yu Ji

Keyword(s):

Low Temperature ◽

Low Cost ◽

Alkali Atom ◽

Anodic Bonding ◽

Foaming Process ◽

Vapor Cells ◽

Chemical Foaming

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Hemipherical wineglass shells fabricated by a Chemical Foaming Process

2015 16th International Conference on Electronic Packaging Technology (ICEPT) ◽

10.1109/icept.2015.7236736 ◽

2015 ◽

Author(s):

Bin Luo ◽

Jintang Shang ◽

Yuzhen Zhang

Keyword(s):

Foaming Process ◽

Chemical Foaming

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Integration of on-chip glass microfluidic system by a chemical foaming process (CFP)

2012 IEEE 62nd Electronic Components and Technology Conference ◽

10.1109/ectc.2012.6249042 ◽

2012 ◽

Author(s):

Jintang Shang ◽

Xinhu Luo ◽

Shunjin Qin ◽

Wei Lin ◽

Ching-Ping Wong ◽

...

Keyword(s):

Microfluidic System ◽

Foaming Process ◽

On Chip ◽

Chemical Foaming

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