Modelling and characterization on wafer to wafer hybrid bonding technology for 3D IC packaging

2019 IEEE 21st Electronics Packaging Technology Conference (EPTC) ◽

10.1109/eptc47984.2019.9026578 ◽

2019 ◽

Author(s):

L. Ji ◽

F.X. Che ◽

H.M. Ji ◽

H.Y. Li ◽

M. Kawano

Keyword(s):

3D Ic ◽

3D Ic Packaging ◽

Ic Packaging ◽

Bonding Technology

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TSV Core Technology for 3D IC Packaging

Journal of Welding and Joining ◽

10.5781/kwjs.2009.27.3.004 ◽

2009 ◽

Vol 27 (3) ◽

pp. 4-9

Author(s):

Seung-Min Hyun ◽

Chang-Woo Lee

Keyword(s):

3D Ic ◽

Core Technology ◽

3D Ic Packaging ◽

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3D IC Integration and 3D IC Packaging

Semiconductor Advanced Packaging ◽

10.1007/978-981-16-1376-0_7 ◽

2021 ◽

pp. 343-378

Author(s):

John H. Lau

Keyword(s):

3D Ic ◽

3D Ic Packaging ◽

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Reliability study of 3D IC packaging based on through-silicon interposer (TSI) and silicon-less interconnection technology (SLIT) using finite element analysis

Microelectronics Reliability ◽

10.1016/j.microrel.2015.12.041 ◽

2016 ◽

Vol 61 ◽

pp. 64-70 ◽

Author(s):

Fa Xing Che ◽

Xiaowu Zhang ◽

Jong-Kai Lin

Keyword(s):

Finite Element Analysis ◽

Finite Element ◽

Reliability Study ◽

Element Analysis ◽

3D Ic ◽

3D Ic Packaging ◽

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Fundamentals of Heat Dissipation in 3D IC Packaging

3D Microelectronic Packaging - Springer Series in Advanced Microelectronics ◽

10.1007/978-3-319-44586-1_10 ◽

2017 ◽

pp. 245-260 ◽

Author(s):

Satish G. Kandlikar ◽

Amlan Ganguly

Keyword(s):

Heat Dissipation ◽

3D Ic ◽

3D Ic Packaging ◽

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Reliability challenges in 3D IC packaging technology

Microelectronics Reliability ◽

10.1016/j.microrel.2010.09.031 ◽

2011 ◽

Vol 51 (3) ◽

pp. 517-523 ◽

Author(s):

K.N. Tu

Keyword(s):

3D Ic ◽

Packaging Technology ◽

3D Ic Packaging ◽

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Mechanical strength of thin Cu-TSV memory dies used in 3D IC packaging

2015 10th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) ◽

10.1109/impact.2015.7365247 ◽

2015 ◽

Author(s):

Y. C. Chao ◽

P. S. Huang ◽

H. T. Keng ◽

M. Y. Tsai ◽

P. C. Lin

Keyword(s):

Mechanical Strength ◽

3D Ic ◽

3D Ic Packaging ◽

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A multilevel sub-modeling approach to evaluate 3D IC packaging induced stress on hybrid interconnect structures

Microelectronic Engineering ◽

10.1016/j.mee.2013.12.005 ◽

2014 ◽

Vol 120 ◽

pp. 85-89 ◽

Author(s):

M. Lofrano ◽

B. Vandevelde ◽

M. Gonzalez

Keyword(s):

3D Ic ◽

Modeling Approach ◽

Induced Stress ◽

3D Ic Packaging ◽

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Low cost, room temperature debondable spin-on temporary bonding solution: A key enabler for 2.5D/3D IC packaging

2013 IEEE 63rd Electronic Components and Technology Conference ◽

10.1109/ectc.2013.6575558 ◽

2013 ◽

Author(s):

Ranjith Samuel E. John ◽

Herman Meynen ◽

Sheng Wang ◽

Peng-Fei Fu ◽

Craig Yeakle ◽

...

Keyword(s):

Room Temperature ◽

Low Cost ◽

3D Ic ◽

3D Ic Packaging ◽

Ic Packaging ◽

Temporary Bonding

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Precipitation of large Ag3Sn intermetallic compounds in SnAg2.5 microbumps after multiple reflows in 3D-IC packaging

Materials Chemistry and Physics ◽

10.1016/j.matchemphys.2012.02.074 ◽

2012 ◽

Vol 134 (1) ◽

pp. 340-344 ◽

Author(s):

Ruo-Wei Yang ◽

Yuan-Wei Chang ◽

Wei-Chi Sung ◽

Chih Chen

Keyword(s):

Intermetallic Compounds ◽

3D Ic ◽

3D Ic Packaging ◽

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Heat dissipation assessment of through silicon via (TSV)-based 3D IC packaging for CMOS image sensing

Microelectronics Reliability ◽

10.1016/j.microrel.2015.12.028 ◽

2016 ◽

Vol 59 ◽

pp. 84-94 ◽

Author(s):

Hsien-Chie Cheng ◽

Tzu-Chin Huang ◽

Po-Wen Hwang ◽

Wen-Hwa Chen

Keyword(s):

Heat Dissipation ◽

3D Ic ◽

Through Silicon Via ◽

Image Sensing ◽

3D Ic Packaging ◽

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