Detection of transmission lines discontinuities on printed circuit boards based on signal frequency analyses

2012 ◽  
Author(s):  
T. Blecha ◽  
R. Linhart
Keyword(s):  
Transmission Lines ◽  
Printed Circuit Boards ◽  
Signal Frequency ◽  
Circuit Boards ◽  
Printed Circuit

scholarly journals Electromagnetic interference in a multiconductor transmission system – MTL

2019 ◽  
Vol XXII (2) ◽  
pp. 343-351
Author(s):  
Ciocioi I.
Keyword(s):  
Transmission Lines ◽  
Electromagnetic Interference ◽  
Printed Circuit Boards ◽  
Electronic Circuit ◽  
Electromagnetic Coupling ◽  
Circuit Boards ◽  
Printed Circuit ◽  
Different Types ◽  
Correct Function ◽  
Coupling Phenomena

In electrical and electronic practice, many connection and transmission elements (cables) are used as a multi-conductor transmission lines (MTL). The electromagnetic fields existing in the environment of these multiconductor transmission lines and can generate different types of coupling phenomena, causing EMC problems by the appearance of the unwanted EMI, disturbing the correct function and altering the information. Electromagnetic coupling between the circuits/cables of a circuit (also known as crosstalk) can also occur between the signal and power paths of an assembly made on printed circuit boards, PCB (printed board circuit), so it is important that when designing such an electrical / electronic circuit, these aspects should be taken into account.

System Level FA on Transmission Line Issues

2010 ◽  
Author(s):  
Nicholas Konkol
Keyword(s):  
Failure Analysis ◽  
Transmission Line ◽  
Transmission Lines ◽  
Printed Circuit Boards ◽  
System Level ◽  
Circuit Boards ◽  
Printed Circuit

Abstract One issue that faces failure analysis at the system level is impedance mismatched transmission lines resulting from developers pushing the edge of trace layout recommendations. When transmission lines on printed circuit boards are routed in such a way as to allow for impedance mismatches, the effects can be unwanted on the signal that the line carries. Techniques can be used for discovering if capacitance, resistance, or split planes are creating the impedance mismatches that are resulting in the system level failure seen by the customer.

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