scholarly journals Electromagnetic interference in a multiconductor transmission system – MTL

2019 ◽  
Vol XXII (2) ◽  
pp. 343-351
Author(s):  
Ciocioi I.
Keyword(s):  
Transmission Lines ◽  
Electromagnetic Interference ◽  
Printed Circuit Boards ◽  
Electronic Circuit ◽  
Electromagnetic Coupling ◽  
Circuit Boards ◽  
Printed Circuit ◽  
Different Types ◽  
Correct Function ◽  
Coupling Phenomena

In electrical and electronic practice, many connection and transmission elements (cables) are used as a multi-conductor transmission lines (MTL). The electromagnetic fields existing in the environment of these multiconductor transmission lines and can generate different types of coupling phenomena, causing EMC problems by the appearance of the unwanted EMI, disturbing the correct function and altering the information. Electromagnetic coupling between the circuits/cables of a circuit (also known as crosstalk) can also occur between the signal and power paths of an assembly made on printed circuit boards, PCB (printed board circuit), so it is important that when designing such an electrical / electronic circuit, these aspects should be taken into account.

Noise properties of thin-film Ni-P resistors embedded in printed circuit boards

2013 ◽  
Vol 61 (3) ◽  
pp. 731-735
Author(s):  
A.W. Stadler ◽  
Z. Zawiślak ◽  
W. Stęplewski ◽  
A. Dziedzic
Keyword(s):  
Thin Film ◽  
Printed Circuit Boards ◽  
Circuit Boards ◽  
Noise Component ◽  
Printed Circuit ◽  
Resistance Bridge ◽  
Different Types ◽  
Signal Path ◽  
Resistance Fluctuations ◽  
Made In

Abstract. Noise studies of planar thin-film Ni-P resistors made in/on Printed Circuit Boards, both covered with two different types of cladding or uncladded have been described. The resistors have been made of the resistive-conductive-material (Ohmega-Ply©) of 100 Ώ/sq. Noise of the selected pairs of samples has been measured in the DC resistance bridge with a transformer as the first stage in a signal path. 1/f noise caused by resistance fluctuations has been found to be the main noise component. Parameters describing noise properties of the resistors have been calculated and then compared with the parameters of other previously studied thin- and thick-film resistive materials.

scholarly journals Dismantling of Waste Printed Circuit Boards with the Simultaneous Recovery of Copper: Experimental Study and Process Modeling

Materials ◽  
2021 ◽  
Vol 14 (18) ◽  
pp. 5186
Author(s):  
Szabolcs Fogarasi ◽  
Árpád Imre-Lucaci ◽  
Florica Imre-Lucaci
Keyword(s):  
Environmental Performance ◽  
Printed Circuit Boards ◽  
Electrochemical Process ◽  
Circuit Boards ◽  
Electronic Components ◽  
Printed Circuit ◽  
Waste Printed Circuit Boards ◽  
Different Types ◽  
Leaching Solution ◽  
The Impact

The study was carried out with the aim to demonstrate the applicability of a combined chemical–electrochemical process for the dismantling of waste printed circuit boards (WPCBs) created from different types of electronic equipment. The concept implies a simple and less polluting process that allows the chemical dismantling of WPCBs with the simultaneous recovery of copper from the leaching solution and the regeneration of the leaching agent. In order to assess the performance of the dismantling process, various tests were performed on different types of WPCBs using the 0.3 M FeCl3 in 0.5 M HCl leaching system. The experimental results show that, through the leaching process, the electronic components (EC) together with other fractions can be efficiently dismounted from the surface of WPCBs, with the parallel electrowinning of copper from the copper rich leaching solution. In addition, the process was scaled up for the dismantling of 100 kg/h WPCBs and modeled and simulated using process flow modelling software ChemCAD in order to assess the impact of all steps and equipment on the technical and environmental performance of the overall process. According to the results, the dismantling of 1 kg of WPCBs requires a total energy of 0.48 kWh, and the process can be performed with an overall low environmental impact based on the obtained general environmental indexes (GEIs) values.

Nanovoid Formation at Cu/Cu/Cu Interconnections of Blind Microvias: A Field Study

2019 ◽  
Vol 2019 (1) ◽  
pp. 000492-000502 ◽  
Author(s):  
T. Bernhard ◽  
L. Gregoriades ◽  
S. Branagan ◽  
L. Stamp ◽  
E. Steinhäuser ◽  
...  
Keyword(s):  
Printed Circuit Boards ◽  
Structural Integrity ◽  
Weak Link ◽  
Critical Factor ◽  
Circuit Boards ◽  
Printed Circuit ◽  
Different Types ◽  
Key Factor ◽  
Electrical Reliability ◽  
The Impact

Abstract A key factor for a high electrical reliability of multilayer High Density Interconnection Printed Circuit Boards (HDI PCBs) is the thermomechanical stability of stacked microvia interconnections. With decreasing via sizes and higher numbers of interconnected layers, the structural integrity of these interconnections becomes a critical factor and is a topic of high interest in current research. The formation of nanovoids and inhibited Cu recrystallization across the interfaces are the two main indications of a weak link from the target pad to the filled via. Based on TEM/EDX measurements on a statistically relevant number of stacked and blind microvias produced in the industrial field, different types of nanovoid phenomena are revealed at the Cu/Cu/Cu junction. The types of nanovoids were categorized relating to the time of appearance (before or after thermal treatment), the affected interfaces or layers and the impact on the Cu recrystallization. The main root causes for each void type are identified and the expected impact on the thermomechanical stability of the via junction is discussed.

scholarly journals Automatic Solder Joint Defect Classification using the Log-Gabor Filter

2010 ◽  
Vol 97-101 ◽  
pp. 2940-2943 ◽  
Author(s):  
Nang Seng Siri Mar ◽  
Clinton Fookes ◽  
K.D.V. Yarlagadda Prasad
Keyword(s):  
Solder Joint ◽  
Manufacturing Industry ◽  
Printed Circuit Boards ◽  
Distance Measure ◽  
Gabor Filter ◽  
Circuit Boards ◽  
Printed Circuit ◽  
Different Types ◽  
Gabor Filter Bank

This paper proposes the validity of a Gabor filter bank for feature extraction of solder joint images on Printed Circuit Boards (PCBs). A distance measure based on the Mahalanobis Cosine metric is also presented for classification of five different types of solder joints. From the experimental results, this methodology achieved high accuracy and a well generalised performance. This can be an effective method to reduce cost and improve quality in the production of PCBs in the manufacturing industry.

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