System Level FA on Transmission Line Issues

2010 ◽  
Author(s):  
Nicholas Konkol
Keyword(s):  
Failure Analysis ◽  
Transmission Line ◽  
Transmission Lines ◽  
Printed Circuit Boards ◽  
System Level ◽  
Circuit Boards ◽  
Printed Circuit

Abstract One issue that faces failure analysis at the system level is impedance mismatched transmission lines resulting from developers pushing the edge of trace layout recommendations. When transmission lines on printed circuit boards are routed in such a way as to allow for impedance mismatches, the effects can be unwanted on the signal that the line carries. Techniques can be used for discovering if capacitance, resistance, or split planes are creating the impedance mismatches that are resulting in the system level failure seen by the customer.

Mechanical Test of FPCB and Failure Analysis by Simulation

2009 ◽  
Author(s):  
Jian Zhong ◽  
Ping Yang ◽  
Jian-ping Li ◽  
Hai-bo Sun ◽  
Quayle Chen ◽  
...  
Keyword(s):  
Failure Analysis ◽  
Printed Circuit Boards ◽  
Simulation Analysis ◽  
Mechanical Test ◽  
Mechanical Tests ◽  
Stress Distributions ◽  
Circuit Boards ◽  
Printed Circuit ◽  
Depth Analysis ◽  
Flexible Printed Circuit

The paper mainly presented mechanical test and failure analysis methods to reliability study of a new FPCB (Flexible Printed Circuit Boards). Mechanical tests include flexural test, tensile test and flexural fatigue and ductility test. As to simulation analysis, the stress distributions of FPCB under bending and tensile conditions were gained by simulations. Through in-depth analysis of the testing results, the mechanical reliability of FPCB was known detailed. The research provides an approach to improve FPCB performance.

Failure analysis of printed circuit boards in the main telephone system of marine product factory

2016 ◽  
Vol 62 ◽  
pp. 300-305 ◽  
Author(s):  
Masamitsu Watanabe ◽  
Masaaki Takaya ◽  
Morihiko Matsumoto ◽  
Jun'ichi Sakai
Keyword(s):  
Failure Analysis ◽  
Printed Circuit Boards ◽  
Circuit Boards ◽  
Printed Circuit ◽  
Telephone System ◽  
Marine Product

A System Level Thermal Analysis of Large Telecommunication Racks

2003 ◽  
Author(s):  
L. T. Yeh
Keyword(s):  
Thermal Analysis ◽  
Flow Rate ◽  
Printed Circuit Boards ◽  
System Level ◽  
Circuit Boards ◽  
Air Flow Rate ◽  
Printed Circuit ◽  
Computational Fluid Dynamics Cfd ◽  
Cfd Method ◽  
Level Analysis

A system level thermal analysis is performed by employing the computational fluid dynamics (CFD) method on a large telecommunication rack. Each rack consists of two identical shelves located on the top-to-bottom orientation. Each shelf includes one fan tray with 6 fans, 3 card cages with a total of 50 printed circuit boards (PCBs). Air enters from the front of the shelf, and then makes a 90-degree turn upwards through PCBs, and finally turns another 90-degree to exit the system from the back of the shelf. The system level analysis is performed independently on each shelf. The main purpose of the analysis is to determine the air flow rate to individual printed circuit boards as well as the air temperature distribution in the system. The computed flow rate for individual PCBs is then used for a detailed board analysis to predict the component temperatures of individual boards.

scholarly journals Electromagnetic interference in a multiconductor transmission system – MTL

2019 ◽  
Vol XXII (2) ◽  
pp. 343-351
Author(s):  
Ciocioi I.
Keyword(s):  
Transmission Lines ◽  
Electromagnetic Interference ◽  
Printed Circuit Boards ◽  
Electronic Circuit ◽  
Electromagnetic Coupling ◽  
Circuit Boards ◽  
Printed Circuit ◽  
Different Types ◽  
Correct Function ◽  
Coupling Phenomena

In electrical and electronic practice, many connection and transmission elements (cables) are used as a multi-conductor transmission lines (MTL). The electromagnetic fields existing in the environment of these multiconductor transmission lines and can generate different types of coupling phenomena, causing EMC problems by the appearance of the unwanted EMI, disturbing the correct function and altering the information. Electromagnetic coupling between the circuits/cables of a circuit (also known as crosstalk) can also occur between the signal and power paths of an assembly made on printed circuit boards, PCB (printed board circuit), so it is important that when designing such an electrical / electronic circuit, these aspects should be taken into account.

Sign in / Sign up

Export Citation Format

Share Document