Thermal Stress Analysis of Epoxy Resin Encapsulated Solid State Transformer's Cracking Caused by Temperature Shock

Author(s):  
Yixian Dai ◽  
Yushun Zhao ◽  
Wei Yang ◽  
Yun Chen ◽  
Long Wei
2003 ◽  
Vol 2003 (0) ◽  
pp. 385-386
Author(s):  
Wakako ARAKI ◽  
Tadaharu ADACHI ◽  
Akihiko YAMAJI

2010 ◽  
Vol 46 (10) ◽  
pp. 889-895 ◽  
Author(s):  
Moisés M. Pariona ◽  
Josuel K. Rugenski ◽  
Manuel V. Canté ◽  
José E. Spinelli ◽  
Amauri Garcia

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