Effect of gold and copper on microstructural evolution and mechanical durability of SAC305 solder joints

2014 International Conference on Electronics Packaging (ICEP) ◽

10.1109/icep.2014.6826682 ◽

2014 ◽

Author(s):

S. Mukherjee ◽

A. Dasgupta ◽

J. Silk ◽

L. L. Ong

Keyword(s):

Microstructural Evolution ◽

Solder Joints ◽

Sac305 Solder ◽

Mechanical Durability

Download Full-text

Effect of Gold Content on the Microstructural Evolution of SAC305 Solder Joints Under Isothermal Aging

Journal of Electronic Materials ◽

10.1007/s11664-011-1744-4 ◽

2011 ◽

Vol 41 (2) ◽

pp. 224-231 ◽

Author(s):

Mike Powers ◽

Jianbiao Pan ◽

Julie Silk ◽

Patrick Hyland

Keyword(s):

Microstructural Evolution ◽

Isothermal Aging ◽

Solder Joints ◽

Gold Content ◽

Download Full-text

Microstructural Evolution of SAC305 Solder Joints in Wafer Level Chip-Scale Packaging (WLCSP) with Continuous and Interrupted Accelerated Thermal Cycling

Journal of Electronic Materials ◽

10.1007/s11664-016-4343-6 ◽

2016 ◽

Vol 45 (6) ◽

pp. 3013-3024 ◽

Author(s):

Quan Zhou ◽

Bite Zhou ◽

Tae-Kyu Lee ◽

Thomas Bieler

Keyword(s):

Thermal Cycling ◽

Microstructural Evolution ◽

Solder Joints ◽

Wafer Level ◽

Sac305 Solder ◽

Accelerated Thermal Cycling

Download Full-text

Effects of high temperature aging on the microstructural evolution and mechanical behavior of SAC305 solder joints using synchrotron X-ray microdiffraction and nanoindentation

Journal of Materials Science Materials in Electronics ◽

10.1007/s10854-017-7189-7 ◽

2017 ◽

Vol 28 (18) ◽

pp. 13496-13506 ◽

Author(s):

Md Hasnine ◽

Jeffrey C. Suhling ◽

Michael J. Bozack

Keyword(s):

High Temperature ◽

Mechanical Behavior ◽

Microstructural Evolution ◽

Solder Joints ◽

Sac305 Solder ◽

X Ray ◽

High Temperature Aging ◽

Temperature Aging

Download Full-text

Variability of Mechanical Cycling Durability of SAC305 Solder Joints: Model-Based Assessment using Grain-scale Modeling of Cyclic Shear Loading

2021 22nd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) ◽

10.1109/eurosime52062.2021.9410828 ◽

2021 ◽

Author(s):

Abhishek Deshpande ◽

Qian Jiang ◽

Abhijit Dasgupta

Keyword(s):

Solder Joints ◽

Shear Loading ◽

Sac305 Solder ◽

Cyclic Shear ◽

Model Based ◽

Scale Modeling ◽

Mechanical Cycling

Download Full-text

Effect of high temperature thermal aging on microstructural evolution of Sn3Ag0.5Cu/Cu solder joints

2013 14th International Conference on Electronic Packaging Technology ◽

10.1109/icept.2013.6756579 ◽

2013 ◽

Author(s):

Hailong Li ◽

Mingliang Fu ◽

Mei Zhu ◽

Rong An ◽

Chunqing Wang ◽

...

Keyword(s):

High Temperature ◽

Microstructural Evolution ◽

Thermal Aging ◽

Download Full-text

Effect of Material Anisotropy on Deformation Behavior of Multiple Grained Sac305 Solder Joints

10.1115/1.0003650v ◽

2021 ◽

Author(s):

Debabrata Mondal ◽

Abdullah Fahim ◽

KM Rafidh Hassan ◽

Jeffrey Suhling ◽

Pradeep Lall

Keyword(s):

Deformation Behavior ◽

Solder Joints ◽

Material Anisotropy ◽

Download Full-text

Determination of Anand Parameters From Creep Testing of Sac305 Solder Joints

10.1115/1.0003637v ◽

2021 ◽

Author(s):

Mohammad Ashraful Haq ◽

Mohd Aminul Hoque ◽

Jeffrey Suhling ◽

Pradeep Lall

Keyword(s):

Solder Joints ◽

Creep Testing ◽

Download Full-text

Prediction of Stress-Strain Behavior of Thermally Cycled SAC305 Solder Joints by Finite Element Modeling and Nanoindentation Characterization

2021 20th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm) ◽

10.1109/itherm51669.2021.9503218 ◽

2021 ◽

Author(s):

Abdullah Fahim ◽

Kamrul Hasan ◽

Jeffrey C. Suhling ◽

Pradeep Lall

Keyword(s):

Finite Element ◽

Finite Element Modeling ◽

Solder Joints ◽

Sac305 Solder ◽

Stress Strain ◽

Element Modeling ◽

Strain Behavior

Download Full-text

Microstructural evolution and atomic transport by thermomigration in eutectic tin-lead flip chip solder joints

Journal of Applied Physics ◽

10.1063/1.2769270 ◽

2007 ◽

Vol 102 (4) ◽

pp. 043502 ◽

Author(s):

Dan Yang ◽

B. Y. Wu ◽

Y. C. Chan ◽

K. N. Tu

Keyword(s):

Microstructural Evolution ◽

Flip Chip ◽

Solder Joints ◽

Atomic Transport

Download Full-text

Effect of Au Content on Microstructural Evolution of SnAgCu Solder Joints that Undergo Isothermal Aging and Reliability Testing

10.15368/theses.2011.163 ◽

2011 ◽

Author(s):

Patrick J Hyland

Keyword(s):

Microstructural Evolution ◽

Isothermal Aging ◽

Solder Joints ◽

Reliability Testing ◽

Download Full-text