Feasibility analysis of the stacked-die ceramic packaging process in automotive electronics

2017 ◽  
Author(s):  
Chongchong Mao ◽  
Yuan Zhu ◽  
Lianghai Li
Keyword(s):  
Feasibility Analysis ◽  
Automotive Electronics ◽  
Packaging Process

Stool bat-26 testing as adjunct to screening sigmoidoscopy: A feasibility analysis

2001 ◽  
Vol 120 (5) ◽  
pp. A599-A599
Author(s):  
D AHLQUIST ◽  
S THIBODEAU ◽  
B LEVIN ◽  
J JEN ◽  
M DEVENS ◽  
...  
Keyword(s):  
Feasibility Analysis

Automotive Electronics

IEE Review ◽  
1992 ◽  
Vol 38 (1) ◽  
pp. 32 ◽  
Author(s):  
M.H. Westbrook
Keyword(s):  
Automotive Electronics

Automotive Electronics

IEE Review ◽  
1988 ◽  
Vol 34 (5) ◽  
pp. 202
Author(s):  
C.H.G. Mills
Keyword(s):  
Automotive Electronics

Development of Wafer Level Chip Size Packaging Process and its Application to the CMOS Image Sensor Module for Medical Device

2017 ◽  
Vol 137 (2) ◽  
pp. 48-58
Author(s):  
Noriyuki Fujimori ◽  
Takatoshi Igarashi ◽  
Takahiro Shimohata ◽  
Takuro Suyama ◽  
Kazuhiro Yoshida ◽  
...  
Keyword(s):  
Medical Device ◽  
Cmos Image Sensor ◽  
Image Sensor ◽  
Wafer Level ◽  
Packaging Process ◽  
Sensor Module ◽  
Chip Size

Detecting the 10 Angstroms That Change MEMS Performance

2004 ◽  
Author(s):  
Erika Schutte ◽  
Jack Martin
Keyword(s):  
Thin Films ◽  
Device Performance ◽  
Processing Conditions ◽  
Packaging Process ◽  
Mems Sensor ◽  
Process Characterization ◽  
Measurement Protocol ◽  
Mems Device

Abstract An ellipsometry based measurement protocol was developed to evaluate changes to MEMS sensor surfaces which may occur during packaging using unpatterned test samples. This package-level technique has been used to measure the 0-20 Angstrom thin films that can form or deposit on die during the packaging process for a variety of packaging processing conditions. Correlations with device performance shows this to be a useful tool for packaged MEMS device and process characterization.

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