Design, Fabrication, and Characterization of a Readout Integrated Circuit (ROIC) for Capacitive MEMS Sensors

Author(s):  
MyungLae Lee ◽  
SungSik Lee ◽  
SungHae Jung ◽  
ChangHan Je ◽  
Gunn Hwang ◽  
...  
Author(s):  
Kemining W. Yeh ◽  
Richard S. Muller ◽  
Wei-Kuo Wu ◽  
Jack Washburn

Considerable and continuing interest has been shown in the thin film transducer fabrication for surface acoustic waves (SAW) in the past few years. Due to the high degree of miniaturization, compatibility with silicon integrated circuit technology, simplicity and ease of design, this new technology has played an important role in the design of new devices for communications and signal processing. Among the commonly used piezoelectric thin films, ZnO generally yields superior electromechanical properties and is expected to play a leading role in the development of SAW devices.


2019 ◽  
Vol 35 (4) ◽  
pp. 475-484
Author(s):  
SHIVA ARUN ◽  
◽  
PRABHA BHARTIYA ◽  
AMREEN NAZ ◽  
SUDHEER RAI ◽  
...  

2019 ◽  
Vol 139 (11) ◽  
pp. 375-380
Author(s):  
Harutoshi Takahashi ◽  
Yuta Namba ◽  
Takashi Abe ◽  
Masayuki Sohgawa

2015 ◽  
Vol 135 (11) ◽  
pp. 474-475
Author(s):  
Koji Sugano ◽  
Ryoji Hiraoka ◽  
Toshiyuki Tsuchiya ◽  
Osamu Tabata

Author(s):  
Alan Huffman ◽  
John Lannon ◽  
Matthew Lueck ◽  
Christopher Gregory ◽  
Dorota Temple

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