Thermosonic flip chip bonding using lateral vibration with anisotropic conductive film (ACF)

2009 ◽  
Author(s):  
Tae-Young Jang ◽  
Chang-Wan Ha ◽  
Kyung-Soo Kim
Keyword(s):  
Flip Chip ◽  
Lateral Vibration ◽  
Anisotropic Conductive Film ◽  
Flip Chip Bonding ◽  
Conductive Film

Using lateral vibration for thermosonic flip-chip interconnection with anisotropic conductive film

2010 ◽  
Vol 20 (10) ◽  
pp. 105015 ◽  
Author(s):  
Kyung-Soo Kim ◽  
Chang-Wan Ha ◽  
Tae-Young Jang ◽  
Sang Won Joung ◽  
Won-Soo Yun
Keyword(s):  
Flip Chip ◽  
Lateral Vibration ◽  
Anisotropic Conductive Film ◽  
Conductive Film

Effects of Ultrasonic Power on Bonding Strength of Anisotropic Conductive Film Joint in Chip-on-Glass Assembly

2011 ◽  
Vol 189-193 ◽  
pp. 3466-3469
Author(s):  
Yong Cheng Lin ◽  
Hao Jin ◽  
Xiao Nan Fang ◽  
Jun Zhang
Keyword(s):  
Electronic Packaging ◽  
Bonding Strength ◽  
Flip Chip ◽  
Ultrasonic Power ◽  
Anisotropic Conductive Film ◽  
Flip Chip Bonding ◽  
Conductive Film ◽  
Bonding Technology

Polymer-based anisotropic conductive film has become widely used in many electronic packaging interconnect applications. In this study, thermosonic flip chip bonding technology for anisotropic conductive film (ACF) joints of chip-on-glass (COG) assembly is investigated. The effects of ultrasonic power on the curing degree and bonding strength of anisotropic conductive film joints are discussed. The results show that (1) The bonding strength of the ACF joints firstly increases and then fast decreases when the ultrasonic power is continuously increased; (2) The curing degree of ACF material increases with the increase of the ultrasonic power. When the ultrasonic power is 3.52W, the curing degree of ACF material can reach 94.1%; (3) The optimized value of ultrasonic power is 3.5W for the studied assembly.

Anisotropic conductive film & flip-chip bonding for low-cost sensor prototyping on rigid & flex PCB

2020 ◽  
Author(s):  
Serguei Stoukatch ◽  
Nicolas Andre ◽  
Thibault Delhaye ◽  
Francois Dupont ◽  
Jean-Michel Redoute ◽  
...  
Keyword(s):  
Flip Chip ◽  
Low Cost ◽  
Anisotropic Conductive Film ◽  
Flip Chip Bonding ◽  
Conductive Film

Microwave model of anisotropic conductive film flip-chip interconnections for high frequency applications

1999 ◽  
Vol 22 (4) ◽  
pp. 575-581 ◽  
Author(s):  
Myung-Jin Yim ◽  
Woonghwan Ryu ◽  
Young-Doo Jeon ◽  
Junho Lee ◽  
Seungyoung Ahn ◽  
...  
Keyword(s):  
High Frequency ◽  
Flip Chip ◽  
Anisotropic Conductive Film ◽  
Conductive Film
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