Analysis of the contact Pressure between an Au bump and a terminal in a flip chip using the anisotropic conductive film

The Proceedings of The Computational Mechanics Conference ◽

10.1299/jsmecmd.2003.16.675 ◽

2003 ◽

Vol 2003.16 (0) ◽

pp. 675-676

Author(s):

Masaki NAGAI ◽

Won Keun KIM ◽

Toru IKEDA ◽

Noriyuki MIYAZAKI

Keyword(s):

Contact Pressure ◽

Flip Chip ◽

Anisotropic Conductive Film ◽

Conductive Film

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Microwave model of anisotropic conductive film flip-chip interconnections for high frequency applications

IEEE Transactions on Components and Packaging Technologies ◽

10.1109/6144.814974 ◽

1999 ◽

Vol 22 (4) ◽

pp. 575-581 ◽

Author(s):

Myung-Jin Yim ◽

Woonghwan Ryu ◽

Young-Doo Jeon ◽

Junho Lee ◽

Seungyoung Ahn ◽

...

Keyword(s):

High Frequency ◽

Flip Chip ◽

Anisotropic Conductive Film ◽

Conductive Film

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Visible Light-Emitting Diodes With Thin-Film-Flip- Chip-Based Wafer-Level Chip-Scale Package Technology Using Anisotropic Conductive Film Bonding

IEEE Electron Device Letters ◽

10.1109/led.2015.2434053 ◽

2015 ◽

Vol 36 (7) ◽

pp. 702-704 ◽

Author(s):

Keon Hwa Lee ◽

Seung Hwan Kim ◽

Woo-Sik Lim ◽

June-O Song ◽

Jae-Hyun Ryou

Keyword(s):

Thin Film ◽

Visible Light ◽

Flip Chip ◽

Light Emitting Diodes ◽

Anisotropic Conductive Film ◽

Wafer Level ◽

Light Emitting ◽

Conductive Film ◽

Chip Scale Package

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Review paper: Flip chip bonding with anisotropic conductive film (ACF) and nonconductive adhesive (NCA)

Current Applied Physics ◽

10.1016/j.cap.2013.05.009 ◽

2013 ◽

Vol 13 ◽

pp. S14-S25 ◽

Author(s):

Sun-Chul Kim ◽

Young-Ho Kim

Keyword(s):

Flip Chip ◽

Review Paper ◽

Anisotropic Conductive Film ◽

Flip Chip Bonding ◽

Conductive Film

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ACF (Anisotropic Conductive Film) Batch Bonding Connection changing Flip Chip Bonding technology

Polytronic 2007 - 6th International Conference on Polymers and Adhesives in Microelectronics and Photonics ◽

10.1109/polytr.2007.4339151 ◽

2007 ◽

Author(s):

Tatsuo Nagamatsu ◽

Yuuji Kakiuchi ◽

Yasuhiro Suga

Keyword(s):

Flip Chip ◽

Anisotropic Conductive Film ◽

Flip Chip Bonding ◽

Conductive Film ◽

Bonding Technology

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Effects of Heating Rate on Material Properties of Anisotropic Conductive Film (ACF) and Thermal Cycling Reliability of ACF Flip Chip Assembly

IEEE Transactions on Components and Packaging Technologies ◽

10.1109/tcapt.2008.2001701 ◽

2009 ◽

Vol 32 (2) ◽

pp. 339-346 ◽

Author(s):

Kyung-Woon Jang ◽

Kyung-Wook Paik

Keyword(s):

Thermal Cycling ◽

Heating Rate ◽

Material Properties ◽

Flip Chip ◽

Anisotropic Conductive Film ◽

Conductive Film ◽

Flip Chip Assembly

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Experimental and modeling analysis on moisture induced failures in flip chip on flex interconnections with anisotropic conductive film

Proceedings of 2005 International Conference on Asian Green Electronics, 2005. AGEC. ◽

10.1109/agec.2005.1452340 ◽

2005 ◽

Author(s):

C.Y. Yin ◽

H. Lu ◽

C. Bailey ◽

Y.C. Chan

Keyword(s):

Flip Chip ◽

Anisotropic Conductive Film ◽

Modeling Analysis ◽

Conductive Film

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Highly reliable flip-chip-on-flex package using multilayered anisotropic conductive film

Journal of Electronic Materials ◽

10.1007/s11664-004-0297-1 ◽

2004 ◽

Vol 33 (1) ◽

pp. 76-82 ◽

Author(s):

Myung Jin Yim ◽

Jin-Sang Hwang ◽

Jin Gu Kim ◽

Jin Yong Ahn ◽

Hyung Joon Kim ◽

...

Keyword(s):

Flip Chip ◽

Anisotropic Conductive Film ◽

Conductive Film

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Fine Pitch Compliant Bump Interconnection for Flip chip on Flexible Display Packaging by Anisotropic Conductive Film

2007 Proceedings 57th Electronic Components and Technology Conference ◽

10.1109/ectc.2007.373844 ◽

2007 ◽

Author(s):

Yao-Sheng Lin ◽

Tsung-Fu Yang ◽

Wen-Chi Chen ◽

Tai-Hung Chen ◽

Chun-Cheng Cheng ◽

...

Keyword(s):

Flip Chip ◽

Anisotropic Conductive Film ◽

Flexible Display ◽

Conductive Film

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The viability of anisotropic conductive film as a flip chip interconnect technology for MEMS devices

Journal of Micromechanics and Microengineering ◽

10.1088/0960-1317/15/6/003 ◽

2005 ◽

Vol 15 (6) ◽

pp. 1131-1139 ◽

Author(s):

Rekha S Pai ◽

Kevin M Walsh

Keyword(s):

Flip Chip ◽

Mems Devices ◽

Anisotropic Conductive Film ◽

Conductive Film ◽

Interconnect Technology

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Influence of the Bonding Force, Anisotropic Conductive Film (ACF) and Reflow Process on the Flip Chip Assembly

ECS Transactions ◽

10.1149/1.3474158 ◽

2019 ◽

Vol 31 (1) ◽

pp. 189-196

Author(s):

Natiara V. Madalossi ◽

Marcio Otta ◽

Talita Mazon

Keyword(s):

Flip Chip ◽

Anisotropic Conductive Film ◽

Reflow Process ◽

Bonding Force ◽

Conductive Film ◽

Flip Chip Assembly

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