Anisotropic conductive film & flip-chip bonding for low-cost sensor prototyping on rigid & flex PCB
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Low Cost
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2011 ◽
Vol 189-193
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pp. 3466-3469
1999 ◽
Vol 22
(4)
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pp. 575-581
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2015 ◽
Vol 36
(7)
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pp. 702-704
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2003 ◽
Vol 2003.16
(0)
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pp. 675-676
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2009 ◽
Vol 32
(2)
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pp. 339-346
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