Microwave model of anisotropic conductive film flip-chip interconnections for high frequency applications
1999 ◽
Vol 22
(4)
◽
pp. 575-581
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2000 ◽
Vol 23
(3)
◽
pp. 542-545
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Keyword(s):
2015 ◽
Vol 36
(7)
◽
pp. 702-704
◽
Keyword(s):
Keyword(s):
2003 ◽
Vol 2003.16
(0)
◽
pp. 675-676
Keyword(s):
2009 ◽
Vol 32
(2)
◽
pp. 339-346
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Keyword(s):
2004 ◽
Vol 33
(1)
◽
pp. 76-82
◽
Keyword(s):
The viability of anisotropic conductive film as a flip chip interconnect technology for MEMS devices
2005 ◽
Vol 15
(6)
◽
pp. 1131-1139
◽
Keyword(s):