Flip Chip bonding with Elasticity Bonding System and Non Conductive Film suitable for intermetallic compounds formation

2010 ◽  
Author(s):  
Ryoji Kojima ◽  
Takayuki Saito ◽  
Takashi Matsumura ◽  
Taichi Koyama ◽  
Norio Umetsu ◽  
...  
Keyword(s):  
Intermetallic Compounds ◽  
Flip Chip ◽  
Bonding System ◽  
Flip Chip Bonding ◽  
Conductive Film

Thermosonic flip-chip bonding system with a self-planarization feature using polymer

1999 ◽  
Vol 22 (3) ◽  
pp. 468-475 ◽  
Author(s):  
Qing Tan ◽  
B. Schaible ◽  
L.J. Bond ◽  
Yung-Cheng Lee
Keyword(s):  
Flip Chip ◽  
Bonding System ◽  
Flip Chip Bonding

Effects of Ultrasonic Power on Bonding Strength of Anisotropic Conductive Film Joint in Chip-on-Glass Assembly

2011 ◽  
Vol 189-193 ◽  
pp. 3466-3469
Author(s):  
Yong Cheng Lin ◽  
Hao Jin ◽  
Xiao Nan Fang ◽  
Jun Zhang
Keyword(s):  
Electronic Packaging ◽  
Bonding Strength ◽  
Flip Chip ◽  
Ultrasonic Power ◽  
Anisotropic Conductive Film ◽  
Flip Chip Bonding ◽  
Conductive Film ◽  
Bonding Technology

Polymer-based anisotropic conductive film has become widely used in many electronic packaging interconnect applications. In this study, thermosonic flip chip bonding technology for anisotropic conductive film (ACF) joints of chip-on-glass (COG) assembly is investigated. The effects of ultrasonic power on the curing degree and bonding strength of anisotropic conductive film joints are discussed. The results show that (1) The bonding strength of the ACF joints firstly increases and then fast decreases when the ultrasonic power is continuously increased; (2) The curing degree of ACF material increases with the increase of the ultrasonic power. When the ultrasonic power is 3.52W, the curing degree of ACF material can reach 94.1%; (3) The optimized value of ultrasonic power is 3.5W for the studied assembly.

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