Fluxless bonding of silicon chips to ceramic packages using electroplated Au/Sn/Au structure
2009 ◽
Vol 38
(10)
◽
pp. 2106-2111
◽
2017 ◽
Keyword(s):
2002 ◽
Vol 68
(666)
◽
pp. 519-526
◽
2001 ◽
Vol 7
(1)
◽
pp. 27-32
◽
1970 ◽
Vol 3
(2)
◽
pp. 236-239
◽