Fluxless bonding of silicon chips to ceramic packages using electroplated Au/Sn/Au structure

Author(s):  
Pin J. Wang ◽  
Jong S. Kim ◽  
Chin C. Lee
Author(s):  
David Segal

Chapter 3 highlights the critical role materials have in the development of digital computers. It traces developments from the cat’s whisker to valves through to relays and transistors. Accounts are given for transistors and the manufacture of integrated circuits (silicon chips) by use of photolithography. Future potential computing techniques, namely quantum computing and the DNA computer, are covered. The history of computability and Moore’s Law are discussed.


2015 ◽  
Vol 5 (2) ◽  
Author(s):  
Krishna Agarwal ◽  
Rui Chen ◽  
Lian Ser Koh ◽  
Colin J. R. Sheppard ◽  
Xudong Chen

Carbon Trends ◽  
2021 ◽  
pp. 100100
Author(s):  
Kenta Shimomura ◽  
Kaname Imai ◽  
Kenta Nakagawa ◽  
Akira Kawai ◽  
Kazuki Hashimoto ◽  
...  

2012 ◽  
Vol 4 (1) ◽  
pp. 2-7 ◽  
Author(s):  
Azusa Oshima ◽  
Ayumi Hirano-Iwata ◽  
Tomohiro Nasu ◽  
Yasuo Kimura ◽  
Michio Niwano

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