2007 12th International Symposium on Advanced Packaging Materials: Processes, Properties, and Interfaces
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(FIVE YEARS 0)

Published By IEEE

9781424413379, 9781424413386

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Foreword

2007 12th International Symposium on Advanced Packaging Materials: Processes, Properties, and Interfaces ◽

10.1109/isapm.2007.4419922 ◽

2007 ◽

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First-principles simulation study on the effects of dopants on the cohesion of gold grain boundary

2007 12th International Symposium on Advanced Packaging Materials: Processes, Properties, and Interfaces ◽

10.1109/isapm.2007.4419945 ◽

2007 ◽

Author(s):

Y.H. Chew ◽

C.C. Wong ◽

Z. Bakar ◽

J. Ling

Keyword(s):

Grain Boundary ◽

Simulation Study ◽

First Principles

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Advert

2007 12th International Symposium on Advanced Packaging Materials: Processes, Properties, and Interfaces ◽

10.1109/isapm.2007.4419923 ◽

2007 ◽

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Pull strength evaluation of Sn-Pb solder joints made to Au-Pt-Pd conductor on low-temperature co-fired ceramic

2007 12th International Symposium on Advanced Packaging Materials: Processes, Properties, and Interfaces ◽

10.1109/isapm.2007.4419943 ◽

2007 ◽

Author(s):

P. Vianco ◽

F. Uribe ◽

G. Zender

Keyword(s):

Low Temperature ◽

Solder Joints ◽

Strength Evaluation ◽

Pull Strength

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Eutectic liquid in Sol-Gel process for superhydrophobic silica thin films — antistiction of MEMS devices

2007 12th International Symposium on Advanced Packaging Materials: Processes, Properties, and Interfaces ◽

10.1109/isapm.2007.4419937 ◽

2007 ◽

Cited By ~ 1

Author(s):

Yonghao Xiu ◽

Lingbo Zhu ◽

Jack Moon ◽

Dennis W. Hess ◽

C. P. Wong

Keyword(s):

Thin Films ◽

Sol Gel ◽

Mems Devices ◽

Eutectic Liquid ◽

Silica Thin Films ◽

Sol Gel Process ◽

Superhydrophobic Silica

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2007 12th International Symposium on Advanced Packaging Materials: Processes, Properties, and Interfaces ◽

10.1109/isapm.2007.4419924 ◽

2007 ◽

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A novel Ag-Cu lamination process

2007 12th International Symposium on Advanced Packaging Materials: Processes, Properties, and Interfaces ◽

10.1109/isapm.2007.4419941 ◽

2007 ◽

Cited By ~ 3

Author(s):

Pin J. Wang ◽

Jong S. Kim ◽

Chin C. Lee

Keyword(s):

Lamination Process

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Cover 2

2007 12th International Symposium on Advanced Packaging Materials: Processes, Properties, and Interfaces ◽

10.1109/isapm.2007.4419948 ◽

2007 ◽

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Fluxless bonding of silicon chips to ceramic packages using electroplated Au/Sn/Au structure

2007 12th International Symposium on Advanced Packaging Materials: Processes, Properties, and Interfaces ◽

10.1109/isapm.2007.4419926 ◽

2007 ◽

Cited By ~ 2

Author(s):

Pin J. Wang ◽

Jong S. Kim ◽

Chin C. Lee

Keyword(s):

Silicon Chips ◽

Fluxless Bonding

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In-situ thermal deformation measurement of low-k layer using nano-pattern recognition and correlation technique

2007 12th International Symposium on Advanced Packaging Materials: Processes, Properties, and Interfaces ◽

10.1109/isapm.2007.4419946 ◽

2007 ◽

Author(s):

Hongbo Bi ◽

Bongtae Han

Keyword(s):

Pattern Recognition ◽

Thermal Deformation ◽

Deformation Measurement ◽

Correlation Technique ◽

Low K

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2007 12th International Symposium on Advanced Packaging Materials: Processes, Properties, and Interfaces
Latest Publications

TOTAL DOCUMENTS

H-INDEX

Published By IEEE

Foreword

First-principles simulation study on the effects of dopants on the cohesion of gold grain boundary

Advert

Pull strength evaluation of Sn-Pb solder joints made to Au-Pt-Pd conductor on low-temperature co-fired ceramic

Eutectic liquid in Sol-Gel process for superhydrophobic silica thin films — antistiction of MEMS devices

Table of contents

A novel Ag-Cu lamination process

Cover 2

Fluxless bonding of silicon chips to ceramic packages using electroplated Au/Sn/Au structure

In-situ thermal deformation measurement of low-k layer using nano-pattern recognition and correlation technique

Export Citation Format

2007 12th International Symposium on Advanced Packaging Materials: Processes, Properties, and InterfacesLatest Publications

TOTAL DOCUMENTS

H-INDEX

Published By IEEE

Foreword

First-principles simulation study on the effects of dopants on the cohesion of gold grain boundary

Advert

Pull strength evaluation of Sn-Pb solder joints made to Au-Pt-Pd conductor on low-temperature co-fired ceramic

Eutectic liquid in Sol-Gel process for superhydrophobic silica thin films — antistiction of MEMS devices

Table of contents

A novel Ag-Cu lamination process

Cover 2

Fluxless bonding of silicon chips to ceramic packages using electroplated Au/Sn/Au structure

In-situ thermal deformation measurement of low-k layer using nano-pattern recognition and correlation technique

2007 12th International Symposium on Advanced Packaging Materials: Processes, Properties, and Interfaces
Latest Publications