Cleavage Fracture Phenomenon in Silicon Chips with Wafer Grinding-Induced Scratch Marks
2017 ◽
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2013 ◽
Vol 45
(2)
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pp. 682-697
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2002 ◽
Vol 68
(666)
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pp. 519-526
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1999 ◽
Vol 40
(4)
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pp. 459-464
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2001 ◽
Vol 7
(1)
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pp. 27-32
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2001 ◽
Vol 78
(6)
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pp. 429-441
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