Cleavage Fracture Phenomenon in Silicon Chips with Wafer Grinding-Induced Scratch Marks

2011 ◽  
Vol 49 (9) ◽  
Author(s):  
David Segal

Chapter 3 highlights the critical role materials have in the development of digital computers. It traces developments from the cat’s whisker to valves through to relays and transistors. Accounts are given for transistors and the manufacture of integrated circuits (silicon chips) by use of photolithography. Future potential computing techniques, namely quantum computing and the DNA computer, are covered. The history of computability and Moore’s Law are discussed.


2021 ◽  
pp. 116988
Author(s):  
Rakesh Kumar Barik ◽  
Abhijit Ghosh ◽  
Md. BasiruddinSk ◽  
Sankalp Biswal ◽  
Amlan Dutta ◽  
...  

2015 ◽  
Vol 5 (2) ◽  
Author(s):  
Krishna Agarwal ◽  
Rui Chen ◽  
Lian Ser Koh ◽  
Colin J. R. Sheppard ◽  
Xudong Chen

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