The JFET as a photosensitive cell in image sensor arrays
Low Temperature Direct Bond Technology for 3D Microelectronics Integration and Wafer Scale Packaging
2010 ◽
Vol 2010
(1)
◽
pp. 000015-000022
Keyword(s):
On Chip
◽
1997 ◽
Vol 44
(10)
◽
pp. 1699-1705
◽
1968 ◽
Vol 15
(4)
◽
pp. 215-219
◽
1996 ◽
Vol 198-200
◽
pp. 1151-1154
◽
Keyword(s):