Cu passivation with self-assembled monolayers for direct metal bonding in 3D integration

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Maria Lykova ◽  
Iuliana Panchenko ◽  
Marion Geidel ◽  
Johanna Reif ◽  
Juergen M. Wolf ◽  
...  
2006 ◽  
Vol 504 (1-2) ◽  
pp. 367-370 ◽  
Author(s):  
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X.F. Ang ◽  
J. Wei ◽  
Z. Chen ◽  
C.C. Wong

2000 ◽  
Vol 2 (15) ◽  
pp. 3359-3362 ◽  
Author(s):  
M. Zharnikov ◽  
S. Frey ◽  
H. Rong ◽  
Y.-J. Yang ◽  
K. Heister ◽  
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1998 ◽  
Vol 95 (6) ◽  
pp. 1339-1342 ◽  
Author(s):  
R. Michalitsch ◽  
A. El Kassmi ◽  
P. Lang ◽  
A. Yassar ◽  
F. Garnier

2003 ◽  
Vol 104 ◽  
pp. 459-462 ◽  
Author(s):  
R. Klauser ◽  
M. Zharnikov ◽  
I.-H. Hong ◽  
S.-C. Wang ◽  
A. Gölzhäuser ◽  
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2009 ◽  
Vol 25 (1) ◽  
pp. 83-86 ◽  
Author(s):  
Guo-Qiang TAN ◽  
Hai-Yang BO ◽  
Hong-Yan MIAO ◽  
Ao XIA ◽  
Zhong-Liang HE

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