Cu passivation with self-assembled monolayers for direct metal bonding in 3D integration
Keyword(s):
2000 ◽
Vol 2
(15)
◽
pp. 3359-3362
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Keyword(s):
2003 ◽
Vol 104
◽
pp. 459-462
◽
Keyword(s):
Keyword(s):
2009 ◽
Vol 25
(1)
◽
pp. 83-86
◽
1992 ◽