Silver sintered double-sided cooling power package process for controlled Si power semiconductor devices with aluminum top-metallization

2015 ◽  
Author(s):  
M. Barriere ◽  
S. Azzopardi ◽  
R. Roder ◽  
I. Favre ◽  
E. Woirgard ◽  
...  
Keyword(s):  
Semiconductor Devices ◽  
Cooling Power ◽  
Power Semiconductor ◽  
Power Semiconductor Devices

Residual Voids in Degassing Process of Encapsulation Gel for Power Semiconductor Devices

2014 ◽  
Vol 134 (6) ◽  
pp. 432-433
Author(s):  
Masahiro Sato ◽  
Akiko Kumada ◽  
Kunihiko Hidaka ◽  
Keisuke Yamashiro ◽  
Yuji Hayase ◽  
...  
Keyword(s):  
Semiconductor Devices ◽  
Power Semiconductor ◽  
Power Semiconductor Devices
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