2015 IEEE International Workshop on Integrated Power Packaging (IWIPP)
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9781479998838
Latest Documents Most Cited Documents Contributed Authors Related Sources Related Keywords

Energy storage utilizing advanced CVD nanodiamond technology

2015 ◽  
Author(s):  
Stephen E. Minden ◽  
John Fraley ◽  
Lauren Kegley ◽  
Jim Davidson ◽  
David Kerns
Keyword(s):  
Energy Storage

Influence of Si/SiC device selection on losses and magnetics design in an isolated DC-DC converter

2015 ◽  
Author(s):  
Minyu Cai ◽  
Liyao Wu ◽  
Dakshina Murthy-Bellur ◽  
Maryam Saeedifard ◽  
Oleg Wasynczuk
Keyword(s):  
Device Selection

Thermal interface material evaluation for IGBT modules under realistic power cycling conditions

2015 ◽  
Author(s):  
Garron K. Morris ◽  
Matthew Polakowski ◽  
Lixiang Wei ◽  
Martin D. Ball ◽  
Mark G. Phillips ◽  
...  
Keyword(s):  
Thermal Interface Material ◽  
Thermal Interface ◽  
Material Evaluation ◽  
Igbt Modules ◽  
Power Cycling

Development of medium voltage SiC power technology for next generation power electronics

2015 ◽  
Author(s):  
Edward Van Brunt ◽  
David Grider ◽  
Vipindas Pala ◽  
Sei-Hyung Ryu ◽  
Jeff Casady ◽  
...  
Keyword(s):  
Power Electronics ◽  
Next Generation ◽  
Medium Voltage ◽  
Generation Power

High temperature, wide bandgap full-bridge power modules for high frequency applications

2015 ◽  
Author(s):  
Z. Cole ◽  
B. McGee ◽  
J. Stabach ◽  
S. Storkov ◽  
B. Whitaker ◽  
...  
Keyword(s):  
High Temperature ◽  
High Frequency ◽  
Wide Bandgap ◽  
Power Modules

Compact, high-temperature, single-level power modules for 10 to 25 kV DC link voltages using silicon carbide power electronics

2015 ◽  
Author(s):  
Chad B. O'Neal ◽  
Zach Cole ◽  
Jennifer Stabach ◽  
Greg Falling ◽  
Peter Killeen ◽  
...  
Keyword(s):  
Silicon Carbide ◽  
High Temperature ◽  
Power Electronics ◽  
Single Level ◽  
Power Modules
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