2015 IEEE International Workshop on Integrated Power Packaging (IWIPP)

Energy storage utilizing advanced CVD nanodiamond technology

2015 IEEE International Workshop on Integrated Power Packaging (IWIPP) ◽

10.1109/iwipp.2015.7295977 ◽

2015 ◽

Author(s):

Stephen E. Minden ◽

John Fraley ◽

Lauren Kegley ◽

Jim Davidson ◽

David Kerns

Keyword(s):

Energy Storage

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A new generation of power semiconductor packaging paves the way for higher efficiency power conversion

2015 IEEE International Workshop on Integrated Power Packaging (IWIPP) ◽

10.1109/iwipp.2015.7295988 ◽

2015 ◽

Cited By ~ 3

Author(s):

Alex Lidow ◽

David Reusch

Keyword(s):

Power Conversion ◽

Power Semiconductor ◽

New Generation ◽

Semiconductor Packaging ◽

The Way

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Influence of Si/SiC device selection on losses and magnetics design in an isolated DC-DC converter

2015 IEEE International Workshop on Integrated Power Packaging (IWIPP) ◽

10.1109/iwipp.2015.7295980 ◽

2015 ◽

Cited By ~ 3

Author(s):

Minyu Cai ◽

Liyao Wu ◽

Dakshina Murthy-Bellur ◽

Maryam Saeedifard ◽

Oleg Wasynczuk

Keyword(s):

Device Selection

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Thermal interface material evaluation for IGBT modules under realistic power cycling conditions

2015 IEEE International Workshop on Integrated Power Packaging (IWIPP) ◽

10.1109/iwipp.2015.7295991 ◽

2015 ◽

Cited By ~ 6

Author(s):

Garron K. Morris ◽

Matthew Polakowski ◽

Lixiang Wei ◽

Martin D. Ball ◽

Mark G. Phillips ◽

...

Keyword(s):

Thermal Interface Material ◽

Thermal Interface ◽

Material Evaluation ◽

Igbt Modules ◽

Power Cycling

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SiC power devices aspects for high power density and system approach for a successful market implementation

2015 IEEE International Workshop on Integrated Power Packaging (IWIPP) ◽

10.1109/iwipp.2015.7295964 ◽

2015 ◽

Author(s):

Peter Friedrichs

Keyword(s):

Power Density ◽

High Power ◽

System Approach ◽

High Power Density ◽

Power Devices

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Development of medium voltage SiC power technology for next generation power electronics

2015 IEEE International Workshop on Integrated Power Packaging (IWIPP) ◽

10.1109/iwipp.2015.7295981 ◽

2015 ◽

Cited By ~ 3

Author(s):

Edward Van Brunt ◽

David Grider ◽

Vipindas Pala ◽

Sei-Hyung Ryu ◽

Jeff Casady ◽

...

Keyword(s):

Power Electronics ◽

Next Generation ◽

Medium Voltage ◽

Generation Power

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Chip-level and package-level thermal constraints in power semiconductor switch modules

2015 IEEE International Workshop on Integrated Power Packaging (IWIPP) ◽

10.1109/iwipp.2015.7295983 ◽

2015 ◽

Author(s):

Krishna Shenai

Keyword(s):

Power Semiconductor ◽

Thermal Constraints ◽

Semiconductor Switch

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High temperature, wide bandgap full-bridge power modules for high frequency applications

2015 IEEE International Workshop on Integrated Power Packaging (IWIPP) ◽

10.1109/iwipp.2015.7295993 ◽

2015 ◽

Cited By ~ 1

Author(s):

Z. Cole ◽

B. McGee ◽

J. Stabach ◽

S. Storkov ◽

B. Whitaker ◽

...

Keyword(s):

High Temperature ◽

High Frequency ◽

Wide Bandgap ◽

Power Modules

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Compact, high-temperature, single-level power modules for 10 to 25 kV DC link voltages using silicon carbide power electronics

2015 IEEE International Workshop on Integrated Power Packaging (IWIPP) ◽

10.1109/iwipp.2015.7295995 ◽

2015 ◽

Cited By ~ 1

Author(s):

Chad B. O'Neal ◽

Zach Cole ◽

Jennifer Stabach ◽

Greg Falling ◽

Peter Killeen ◽

...

Keyword(s):

Silicon Carbide ◽

High Temperature ◽

Power Electronics ◽

Single Level ◽

Power Modules

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A carrier-based discontinuous space vector modulation for three-level NPC inverter

2015 IEEE International Workshop on Integrated Power Packaging (IWIPP) ◽

10.1109/iwipp.2015.7295982 ◽

2015 ◽

Cited By ~ 1

Author(s):

Chengzhu Piao ◽

John Y. Hung

Keyword(s):

Space Vector Modulation ◽

Space Vector ◽

Vector Modulation

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2015 IEEE International Workshop on Integrated Power Packaging (IWIPP)
Latest Publications

TOTAL DOCUMENTS

H-INDEX

Published By IEEE

Energy storage utilizing advanced CVD nanodiamond technology

A new generation of power semiconductor packaging paves the way for higher efficiency power conversion

Influence of Si/SiC device selection on losses and magnetics design in an isolated DC-DC converter

Thermal interface material evaluation for IGBT modules under realistic power cycling conditions

SiC power devices aspects for high power density and system approach for a successful market implementation

Development of medium voltage SiC power technology for next generation power electronics

Chip-level and package-level thermal constraints in power semiconductor switch modules

High temperature, wide bandgap full-bridge power modules for high frequency applications

Compact, high-temperature, single-level power modules for 10 to 25 kV DC link voltages using silicon carbide power electronics

A carrier-based discontinuous space vector modulation for three-level NPC inverter

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2015 IEEE International Workshop on Integrated Power Packaging (IWIPP)Latest Publications

TOTAL DOCUMENTS

H-INDEX

Published By IEEE

Energy storage utilizing advanced CVD nanodiamond technology

A new generation of power semiconductor packaging paves the way for higher efficiency power conversion

Influence of Si/SiC device selection on losses and magnetics design in an isolated DC-DC converter

Thermal interface material evaluation for IGBT modules under realistic power cycling conditions

SiC power devices aspects for high power density and system approach for a successful market implementation

Development of medium voltage SiC power technology for next generation power electronics

Chip-level and package-level thermal constraints in power semiconductor switch modules

High temperature, wide bandgap full-bridge power modules for high frequency applications

Compact, high-temperature, single-level power modules for 10 to 25 kV DC link voltages using silicon carbide power electronics

A carrier-based discontinuous space vector modulation for three-level NPC inverter

2015 IEEE International Workshop on Integrated Power Packaging (IWIPP)
Latest Publications