Monolithically Integrated MESFET Devices on a High-Speed Silicon Photonics Platform

2014 ◽  
Vol 32 (22) ◽  
pp. 4345-4348 ◽  
Author(s):  
Ari Novack ◽  
Ruizhi Shi ◽  
Matt Streshinsky ◽  
Jingcheng Tao ◽  
Kang Tan ◽  
...  
2016 ◽  
Author(s):  
P. De Dobbelaere ◽  
G. Armijo ◽  
J. Balardeta ◽  
B. Chase ◽  
Y. Chi ◽  
...  

2021 ◽  
pp. 1-1
Author(s):  
Alexandru Giuglea ◽  
Guido Belfiore ◽  
Mohammad Mahdi Khafaji ◽  
Ronny Henker ◽  
Frank Ellinger

2016 ◽  
Vol 2016 (DPC) ◽  
pp. 001663-001681
Author(s):  
Miguel Jimarez

We introduce a high-speed 4x25Gbps, MSA-compliant, QSFP transceiver built on a Silicon Photonics platform. The transceiver integrates high sensitivity receivers, CTLE, clock recovery, modulator drivers and BIST on a TSMC 28nm die connected to the photonic die thru a fine pitch (50um) Copper Pillar interface. A wafer-scale approach, Chip on Wafer, CoW, is used to assemble the electronic die and the light source on to the photonic die, so that the full optical path can be tested, at speed, in loopback configuration in wafer form, using a standard ATE solution. This presentation focuses on the CoW assembly development aspects of the transceiver. Wafer probe and bump, die processing services, CoW assembly and Back End of Line, BEOL, Test Services will be presented.


2019 ◽  
Vol 37 (5) ◽  
pp. 1456-1462 ◽  
Author(s):  
Felix Eltes ◽  
Christian Mai ◽  
Daniele Caimi ◽  
Marcel Kroh ◽  
Youri Popoff ◽  
...  

Author(s):  
Jonathan E. Proesel ◽  
Nicolas Dupuis ◽  
Herschel Ainspan ◽  
Christian W. Baks ◽  
Fuad Doany ◽  
...  

2015 ◽  
Vol 21 (4) ◽  
pp. 207-211 ◽  
Author(s):  
Muhammad A. Naeem ◽  
Mohsin Haji ◽  
Barry M. Holmes ◽  
David C. Hutchings ◽  
John H. Marsh ◽  
...  

2010 ◽  
Vol 18 (17) ◽  
pp. 18312 ◽  
Author(s):  
A. H. Atabaki ◽  
E. Shah Hosseini ◽  
A. A. Eftekhar ◽  
S. Yegnanarayanan ◽  
A. Adibi
Keyword(s):  

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