A high speed optical fiber diameter measurement and characterization system

AbstractThis study presents high speed optical switching gain based Erbium doped fiber amplifier model. By using the proposed model the optical fiber loss can be minimized. The system is stabilized with the power budget of 25.875 mW a long 75 km as a length of optical fiber in this study can be verified. The modulation rate of 10 Gb/s can be upgrade up to reach 30 Gb/s. The suitable power for the optical transmitter is −2.440 dBm and NRZ modulation code is verified. The receiver sensitivity can be upgraded with the minimum bit error rate and max Q factor are 1.806 e−009 and 5.899.

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High speed AlGaAs/GaAs HBT circuits for optical fiber communications

Proceedings of LEOS'94 ◽

10.1109/leos.1994.586879 ◽

2002 ◽

Author(s):

K.C. Wang ◽

K.D. Pedrotti ◽

K. Runge

Keyword(s):

Optical Fiber ◽

High Speed ◽

Optical Fiber Communications ◽

Fiber Communications

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Fiber diameter measurement of bulk man-made vitreous fiber

Analytica Chimica Acta ◽

10.1016/0003-2670(93)85133-5 ◽

1993 ◽

Vol 280 (2) ◽

pp. 289-298 ◽

Cited By ~ 5

Author(s):

A.R. Koenig ◽

R.D. Hamilton ◽

T.E. Laskowski ◽

J.R. Olson ◽

J.F. Gordon ◽

...

Keyword(s):

Fiber Diameter ◽

Diameter Measurement

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ALOHA/slotted-CSMA protocol for a very high-speed optical fiber local area network using passive star topology

IEEE INFCOM '91. The conference on Computer Communications. Tenth Annual Joint Comference of the IEEE Computer and Communications Societies Proceedings ◽

10.1109/infcom.1991.147684 ◽

1991 ◽

Cited By ~ 7

Author(s):

H. Shi ◽

M. Kavehrad

Keyword(s):

Optical Fiber ◽

High Speed ◽

Local Area Network ◽

Local Area ◽

Area Network ◽

Star Topology ◽

Very High

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Ripple Technique; a Novel Non-Contact Wafer Emissivity and Temperature Method for RTP

MRS Proceedings ◽

10.1557/proc-224-23 ◽

1991 ◽

Vol 224 ◽

Cited By ~ 28

Author(s):

C. Schietinger ◽

B. Adams ◽

C. Yarling

Keyword(s):

Optical Fiber ◽

Measurement Technique ◽

Thermal Processing ◽

High Speed ◽

Rapid Thermal Processing ◽

Wafer Surface ◽

Speed Measurement ◽

Temperature Method ◽

Emissivity Measurement ◽

Emissivity Measurements

AbstractA novel wafer temperature and emissivity measurement technique for rapid thermal processing (RTP) is presented. The ‘Ripple Technique’ takes advantage of heating lamp AC ripple as the signature of the reflected component of the radiation from the wafer surface. This application of Optical Fiber Thermometry (OFT) allows high speed measurement of wafer surface temperatures and emissivities. This ‘Ripple Technique’ is discussed in theoretical and practical terms with wafer data presented. Results of both temperature and emissivity measurements are presented for RTP conditions with bare silicon wafers and filmed wafers.

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