Through-Silicon Photonic Via and Unidirectional Coupler for High-Speed Data Transmission in Optoelectronic Three-Dimensional LSI
2012 ◽
Vol 33
(2)
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pp. 221-223
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Keyword(s):
2016 ◽
Vol 11
(01)
◽
pp. C01045-C01045
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2017 ◽
Vol 7
(10)
◽
pp. 10
Keyword(s):