Evaluating Solder Joint Reliability of Airborne Electronics under Harsh Environment Conditions

2021 ◽  
Author(s):  
Harisha Venkategowda ◽  
Swadish Sudhindra ◽  
Ajey Kulgeri ◽  
Shreekanth Muthigi
Keyword(s):  
Solder Joint ◽  
Harsh Environment ◽  
Solder Joint Reliability ◽  
Joint Reliability

Flip chip solder joint reliability under harsh environment

2003 ◽  
Vol 15 (3) ◽  
pp. 15-20 ◽  
Author(s):  
Cheng Bo ◽  
Wang Li ◽  
Zhang Qun ◽  
Gao Xia ◽  
Xie Xiaoming ◽  
...  
Keyword(s):  
Solder Joint ◽  
Flip Chip ◽  
Harsh Environment ◽  
Solder Joint Reliability ◽  
Joint Reliability

Experimental evaluation of SnAgCu solder joint reliability in 100-μm pitch flip-chip assemblies

2014 ◽  
Vol 54 (5) ◽  
pp. 939-944 ◽  
Author(s):  
Ye Tian ◽  
Xi Liu ◽  
Justin Chow ◽  
Yi Ping Wu ◽  
Suresh K. Sitaraman
Keyword(s):  
Solder Joint ◽  
Experimental Evaluation ◽  
Flip Chip ◽  
Solder Joint Reliability ◽  
Snagcu Solder ◽  
Joint Reliability
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