Experimental evaluation of SnAgCu solder joint reliability in 100-μm pitch flip-chip assemblies
2014 ◽
Vol 54
(5)
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pp. 939-944
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2006 ◽
Vol 36
(1)
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pp. 6-16
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2003 ◽
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2002 ◽
Vol 31
(5)
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pp. 520-528
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