The Effects of Proton Irradiation on 90 nm Strained Si CMOS on SOI Devices

Author(s):  
Aravind Appaswamy ◽  
Bongim Jun ◽  
Ryan Diestelhorst ◽  
Gustavo Espinel ◽  
A.P. Prakash ◽  
...  
2018 ◽  
Vol 81 ◽  
pp. 112-116
Author(s):  
Teng Ma ◽  
Xuefeng Yu ◽  
Jiangwei Cui ◽  
Qiwen Zheng ◽  
Hang Zhou ◽  
...  

2017 ◽  
Vol 34 (7) ◽  
pp. 076104
Author(s):  
Teng Ma ◽  
Qi-Wen Zheng ◽  
Jiang-Wei Cui ◽  
Hang Zhou ◽  
Dan-Dan Su ◽  
...  

1998 ◽  
Vol 08 (PR3) ◽  
pp. Pr3-57-Pr3-60
Author(s):  
J. B. Roldán ◽  
F. Gámiz ◽  
J. A. López-Villanueva ◽  
J. E. Carceller

2020 ◽  
Vol 23 (3) ◽  
pp. 227-252
Author(s):  
T.E. Rudenko ◽  
◽  
A.N. Nazarov ◽  
V.S. Lysenko ◽  
◽  
...  

2004 ◽  
Vol 95 (5) ◽  
pp. 340-344 ◽  
Author(s):  
P. Dobrosz ◽  
S. J. Bull ◽  
S. H. Olsen ◽  
A. G. O'Neill

Author(s):  
Z. G. Song ◽  
S. K. Loh ◽  
X. H. Zheng ◽  
S.P. Neo ◽  
C. K. Oh

Abstract This article presents two cases to demonstrate the application of focused ion beam (FIB) circuit edit in analysis of memory failure of silicon on insulator (SOI) devices using XTEM and EDX analyses. The first case was a single bit failure of SRAM units manufactured with 90 nm technology in SOI wafer. The second case was the whole column failure with a single bit pass for a SRAM unit. From the results, it was concluded that FIB circuit edit and electrical characterization is a good methodology for further narrowing down the defective location of memory failure, especially for SOI technology, where contact-level passive voltage contrast is not suitable.


2020 ◽  
Vol 1697 ◽  
pp. 012073
Author(s):  
A A Lebedev ◽  
V Yu Davydov ◽  
A N Smirnov ◽  
I A Eliseyev ◽  
K S Davydovskaya ◽  
...  

2021 ◽  
Vol 266 ◽  
pp. 115078
Author(s):  
R. Ning ◽  
Z.P. Yang ◽  
Z.Y. Gao ◽  
X.Z. Cao ◽  
W. Cai

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