A Study on the Magnetic Dispersion of the Conductive Particles of Anchoring-Polymer-Layer Anisotropic Conductive Films and Its Fine-Pitch Interconnection Properties

IEEE Transactions on Components Packaging and Manufacturing Technology ◽

10.1109/tcpmt.2019.2921055 ◽

2019 ◽

Vol 9 (7) ◽

pp. 1235-1243

Author(s):

Jun-Ho Byeon ◽

Dal-Jin Yoon ◽

Kyung-Wook Paik

Keyword(s):

Polymer Layer ◽

Conductive Films ◽

Conductive Particles

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A Study on the Anchoring Polymer Layer (APL) Anisotropic Conductive Films (ACFs) with Self-Exposed Conductive Particles Surface for Ultra-Fine Pitch Chip-on-Glass (COG) Applications

2019 IEEE 69th Electronic Components and Technology Conference (ECTC) ◽

10.1109/ectc.2019.000-7 ◽

2019 ◽

Author(s):

Dal-Jin Yoon ◽

Kyung-Wook Paik

Keyword(s):

Polymer Layer ◽

Conductive Films ◽

Conductive Particles

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A Study on the Conductive Particle Movements in Polyvinylidene Fluoride Anchoring Polymer Layer Anisotropic Conductive Films for 20- $\mu$ m Fine-Pitch Interconnection

IEEE Transactions on Components Packaging and Manufacturing Technology ◽

10.1109/tcpmt.2019.2891256 ◽

2019 ◽

Vol 9 (2) ◽

pp. 209-215 ◽

Author(s):

Sang-Hoon Lee ◽

Dal-Jin Yoon ◽

Kyung-Wook Paik

Keyword(s):

Polyvinylidene Fluoride ◽

Polymer Layer ◽

Conductive Particle ◽

Conductive Films ◽

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Effects of Polyacrylonitrile Anchoring Polymer Layer Solder Anisotropic Conductive Films on the Solder Ball Movement for Fine-Pitch Flex-on-Flex (FOF) Assembly

IEEE Transactions on Components Packaging and Manufacturing Technology ◽

10.1109/tcpmt.2019.2909095 ◽

2019 ◽

Vol 9 (5) ◽

pp. 830-835 ◽

Author(s):

Dal-Jin Yoon ◽

Sang-Hoon Lee ◽

Kyung-Wook Paik

Keyword(s):

Solder Ball ◽

Polymer Layer ◽

Conductive Films ◽

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A Study on the Novel Nylon Anchoring Polymer Layer(APL) Anisotropic Conductive Films(ACFs) for Ultra Fine Pitch Chip-on-Glass(COG) Applications

2017 IEEE 67th Electronic Components and Technology Conference (ECTC) ◽

10.1109/ectc.2017.91 ◽

2017 ◽

Author(s):

Dal-Jin Yoon ◽

Sanh Hoon Lee ◽

Kyung-Wook Paik

Keyword(s):

Polymer Layer ◽

The Novel ◽

Conductive Films ◽

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A study on the novel anchoring polymer layer(APL) anisotropic conductive films(ACFs) for ultra fine pitch assembly applications

2018 Pan Pacific Microelectronics Symposium (Pan Pacific) ◽

10.23919/panpacific.2018.8318988 ◽

2018 ◽

Author(s):

Kyung-Wook Paik ◽

Dal-Jin Yoon

Keyword(s):

Polymer Layer ◽

The Novel ◽

Conductive Films ◽

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A Study on the Anchoring Polymer Layer(APL) Solder Anisotropic Conductive Films (ACFs) for Ultra Fine Pitch Flex-on-Flex (FOF) Assembly Using an Ultrasonic Bonding Method

2018 IEEE 68th Electronic Components and Technology Conference (ECTC) ◽

10.1109/ectc.2018.00010 ◽

2018 ◽

Author(s):

Dal-Jin Yoon ◽

Sang Hoon Lee ◽

Kyung-Wook Paik

Keyword(s):

Polymer Layer ◽

Conductive Films ◽

Ultrasonic Bonding ◽

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A Study on Polyvinylidene Difluoride (PVDF) Anchoring Polymer Layer (APL) Solder Anisotropic Conductive Films (ACFs) for Fine-Pitch Flex-on-Flex (FOF) Interconnection

IEEE Transactions on Components Packaging and Manufacturing Technology ◽

10.1109/tcpmt.2020.2972556 ◽

2020 ◽

Vol 10 (3) ◽

pp. 368-377

Author(s):

Lu Song ◽

Dal-Jin Yoon ◽

Shuye Zhang ◽

Kyung-Wook Paik

Keyword(s):

Polymer Layer ◽

Polyvinylidene Difluoride ◽

Conductive Films ◽

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Nanofiber ACFs (anisotropic conductive films) for ultra-fine pitch interconnection

2015 IEEE 15th International Conference on Nanotechnology (IEEE-NANO) ◽

10.1109/nano.2015.7388671 ◽

2015 ◽

Author(s):

Kyung-Wook Paik ◽

Sang-Hoon Lee ◽

Tae-Wan Kim

Keyword(s):

Conductive Films ◽

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Effects of the Nylon Anchoring Polymer Layer on the Conductive Particle Movements of Anisotropic Conductive Films for Ultrafine Pitch Chip-on-Glass Applications

IEEE Transactions on Components Packaging and Manufacturing Technology ◽

10.1109/tcpmt.2018.2868514 ◽

2018 ◽

Vol 8 (10) ◽

pp. 1723-1728 ◽

Author(s):

Dal-Jin Yoon ◽

Sang-Hoon Lee ◽

Kyung-Wook Paik

Keyword(s):

Polymer Layer ◽

Conductive Particle ◽

Conductive Films

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Anisotropic conductive films (ACFs) for ultra-fine pitch chip-on-glass (COG) applications

Proceedings. International Symposium on Advanced Packaging Materials: Processes, Properties and Interfaces, 2005. ◽

10.1109/isapm.2005.1432074 ◽

2005 ◽

Author(s):

Myung Jin Yim ◽

Jinsang Hwang ◽

Kyung Wook Paik

Keyword(s):

Conductive Films ◽

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