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Anisotropic conductive films (ACFs) for ultra-fine pitch chip-on-glass (COG) applications
Proceedings. International Symposium on Advanced Packaging Materials: Processes, Properties and Interfaces, 2005.
◽
10.1109/isapm.2005.1432074
◽
2005
◽
Cited By ~ 2
Author(s):
Myung Jin Yim
◽
Jinsang Hwang
◽
Kyung Wook Paik
Keyword(s):
Conductive Films
◽
Fine Pitch
Download Full-text
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References
Nanofiber ACFs (anisotropic conductive films) for ultra-fine pitch interconnection
2015 IEEE 15th International Conference on Nanotechnology (IEEE-NANO)
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10.1109/nano.2015.7388671
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2015
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Author(s):
Kyung-Wook Paik
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Sang-Hoon Lee
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Tae-Wan Kim
Keyword(s):
Conductive Films
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Fine Pitch
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A Study on the Magnetic Dispersion of the Conductive Particles of Anchoring-Polymer-Layer Anisotropic Conductive Films and Its Fine-Pitch Interconnection Properties
IEEE Transactions on Components Packaging and Manufacturing Technology
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10.1109/tcpmt.2019.2921055
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2019
◽
Vol 9
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pp. 1235-1243
Author(s):
Jun-Ho Byeon
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Dal-Jin Yoon
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Kyung-Wook Paik
Keyword(s):
Polymer Layer
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Conductive Particles
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High power and fine pitch assembly using solder Anisotropic Conductive Films (ACFs) combined with ultrasonic bonding technique
2010 Proceedings 60th Electronic Components and Technology Conference (ECTC)
◽
10.1109/ectc.2010.5490937
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2010
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Cited By ~ 3
Author(s):
Kiwon Lee
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Keyword(s):
High Power
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Conductive Films
◽
Ultrasonic Bonding
◽
Fine Pitch
◽
Bonding Technique
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A Study on Nano-Sized Silica Contents and Size Effect in Non-conductive Films (NCFs) for Ultra Fine-Pitch Cu-Pillar/Sn-Ag Micro-Bump Interconnection
2017 IEEE 67th Electronic Components and Technology Conference (ECTC)
◽
10.1109/ectc.2017.101
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2017
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Cited By ~ 1
Author(s):
Hanmin Lee
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Seyong Lee
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Semin Cho
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Younghyun Yu
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Jongho Park
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...
Keyword(s):
Size Effect
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Conductive Films
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Cu Pillar
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Fine Pitch
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A Study on the Double Layer Non Conductive Films (NCFs) for Fine-Pitch Cu-Pillar/Sn-Ag Micro-Bump Interconnection
2016 IEEE 66th Electronic Components and Technology Conference (ECTC)
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10.1109/ectc.2016.128
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2016
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Cited By ~ 6
Author(s):
SeYong Lee
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Ji-Won Shin
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Young Soon Kim
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Keyword(s):
Double Layer
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Fine pitch flex-on-flex (FOF) assembly using nanofiber solder anisotropic conductive films (ACFs) and ultrasonic bonding method
2013 IEEE 63rd Electronic Components and Technology Conference
◽
10.1109/ectc.2013.6575804
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2013
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Author(s):
Sang Hoon Lee
◽
Kyung Lim Suk
◽
Kyung-Wook Paik
Keyword(s):
Conductive Films
◽
Ultrasonic Bonding
◽
Fine Pitch
◽
Bonding Method
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High Performance Nano-scale Conductive Films with Low Temperature Sintering for Fine Pitch Electronic Interconnect
High Density Design Packaging and Microsystem Integration, 2007 International Symposium on
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10.1109/hdp.2007.4283593
◽
2007
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Cited By ~ 1
Author(s):
Yi Li
◽
M.J. Yim
◽
K.S. Moon
◽
C.P. Wong
Keyword(s):
Low Temperature
◽
High Performance
◽
Low Temperature Sintering
◽
Conductive Films
◽
Nano Scale
◽
Fine Pitch
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A Study on the Anchoring Polymer Layer (APL) Anisotropic Conductive Films (ACFs) with Self-Exposed Conductive Particles Surface for Ultra-Fine Pitch Chip-on-Glass (COG) Applications
2019 IEEE 69th Electronic Components and Technology Conference (ECTC)
◽
10.1109/ectc.2019.000-7
◽
2019
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Author(s):
Dal-Jin Yoon
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Kyung-Wook Paik
Keyword(s):
Polymer Layer
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Conductive Films
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A Study on the Conductive Particle Movements in Polyvinylidene Fluoride Anchoring Polymer Layer Anisotropic Conductive Films for 20- $\mu$ m Fine-Pitch Interconnection
IEEE Transactions on Components Packaging and Manufacturing Technology
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10.1109/tcpmt.2019.2891256
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2019
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Vol 9
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pp. 209-215
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Cited By ~ 1
Author(s):
Sang-Hoon Lee
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Dal-Jin Yoon
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Kyung-Wook Paik
Keyword(s):
Polyvinylidene Fluoride
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Polymer Layer
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Conductive Particle
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Conductive Films
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Fine Pitch
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A Study on the Fine Pitch Flex-on-Flex (FOF) Assembly Using Flux Added Nanofiber Solder Anisotropic Conductive Films (ACFs) and Thermo-Compression Bonding Method
2017 IEEE 67th Electronic Components and Technology Conference (ECTC)
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10.1109/ectc.2017.111
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2017
◽
Author(s):
Ji-Soo Lee
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Ji-Hye Kim
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Kyung-Wook Paik
Keyword(s):
Conductive Films
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Fine Pitch
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Bonding Method
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