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2019 IEEE 69th Electronic Components and Technology Conference (ECTC)
Latest Publications
TOTAL DOCUMENTS
363
(FIVE YEARS 363)
H-INDEX
6
(FIVE YEARS 6)
Published By IEEE
9781728114996
Latest Documents
Most Cited Documents
Contributed Authors
Related Sources
Related Keywords
Latest Documents
Most Cited Documents
Contributed Authors
Related Sources
Related Keywords
A Methodology to Correct in-Fixture Measurement of Impedance by a Machine Learning Model
2019 IEEE 69th Electronic Components and Technology Conference (ECTC)
◽
10.1109/ectc.2019.00261
◽
2019
◽
Author(s):
Bo-Siang Fang
◽
Chia-Chu Lai
◽
Ying-Wei Lu
◽
Kuan-Ta Chen
◽
Mike Tasi
◽
...
Keyword(s):
Machine Learning
◽
Learning Model
◽
Machine Learning Model
Download Full-text
Sub-Micron RDL Patterning for Advanced Packaging
2019 IEEE 69th Electronic Components and Technology Conference (ECTC)
◽
10.1109/ectc.2019.00023
◽
2019
◽
Cited By ~ 2
Author(s):
Ken-Ichiro Mori
◽
Yoshio Goto
◽
Yasuo Hasegawa
◽
Seiya Miura
◽
Douglas Shelton
Keyword(s):
Advanced Packaging
Download Full-text
Structuring of Laser Activated Polymers for Sensor Applications
2019 IEEE 69th Electronic Components and Technology Conference (ECTC)
◽
10.1109/ectc.2019.00290
◽
2019
◽
Cited By ~ 3
Author(s):
Sebastian Bengsch
◽
Maximilian Aue
◽
Kevin Cromwell
◽
-Ing. Wurz
◽
Marc Christopher
Keyword(s):
Sensor Applications
Download Full-text
High Temperature Resistant Packaging Technology for SiC Power Module by Using Ni Micro-Plating Bonding
2019 IEEE 69th Electronic Components and Technology Conference (ECTC)
◽
10.1109/ectc.2019.00223
◽
2019
◽
Cited By ~ 1
Author(s):
Kohei Tatsumi
◽
Isamu Morisako
◽
Keiko Wada
◽
Minoru Fukuomori
◽
Tomonori Iizuka
◽
...
Keyword(s):
High Temperature
◽
Power Module
◽
Packaging Technology
Download Full-text
Integrating Solid State Protection with a RF-MEMS Switch for Achieving ESD Robustness
2019 IEEE 69th Electronic Components and Technology Conference (ECTC)
◽
10.1109/ectc.2019.00255
◽
2019
◽
Author(s):
Srivatsan Parthasarathy
◽
Padraig Fitzgerald
◽
Javier Salcedo
◽
Ray Goggin
◽
Jean-Jacques Hajjar
Keyword(s):
Solid State
◽
Rf Mems
◽
Rf Mems Switch
◽
Mems Switch
◽
State Protection
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Multilayer Glass Substrate with High Density Via Structure for All Inorganic Multi-chip Module
2019 IEEE 69th Electronic Components and Technology Conference (ECTC)
◽
10.1109/ectc.2019.00301
◽
2019
◽
Author(s):
Toshiki Iwai
◽
Taiji Sakai
◽
Daisuke Mizutani
◽
Seiki Sakuyama
◽
Kenji Iida
◽
...
Keyword(s):
Glass Substrate
◽
High Density
Download Full-text
28GHz Through Glass Via (TGV) Based Band Pass Filter Using Through Fused Silica Via (TFV) Technology
2019 IEEE 69th Electronic Components and Technology Conference (ECTC)
◽
10.1109/ectc.2019.00110
◽
2019
◽
Author(s):
Renuka Bowrothu
◽
Seahee Hwangbo
◽
Todd Schumann
◽
Yong-Kyu Yoon
Keyword(s):
Fused Silica
◽
Band Pass Filter
◽
Pass Filter
◽
Band Pass
Download Full-text
Defect Detection for the TSV Transmission Channel Using Machine Learning Approach
2019 IEEE 69th Electronic Components and Technology Conference (ECTC)
◽
10.1109/ectc.2019.00-22
◽
2019
◽
Cited By ~ 1
Author(s):
Huan Liu
◽
Runiu Fang
◽
Min Miao
◽
Yang Yang
◽
Yufeng Jin
Keyword(s):
Machine Learning
◽
Defect Detection
◽
Learning Approach
◽
Transmission Channel
◽
Machine Learning Approach
Download Full-text
3D Printed Substrates for the Design of Compact RF Systems
2019 IEEE 69th Electronic Components and Technology Conference (ECTC)
◽
10.1109/ectc.2019.00025
◽
2019
◽
Cited By ~ 1
Author(s):
Mohd Ifwat Mohd Ghazali
◽
Saikat Mondal
◽
Saranraj Karuppuswami
◽
Premjeet Chahal
Keyword(s):
Rf Systems
◽
3D Printed
Download Full-text
Temporary SiC-SiC Wafer Bonding Compatible with High Temperature Annealing
2019 IEEE 69th Electronic Components and Technology Conference (ECTC)
◽
10.1109/ectc.2019.00155
◽
2019
◽
Author(s):
Fengwen Mu
◽
Tadatomo Suga
◽
Miyuki Uomoto
◽
Takehito Shimatsu
Keyword(s):
High Temperature
◽
Wafer Bonding
◽
High Temperature Annealing
◽
Sic Wafer
Download Full-text
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