Wideband Power/Ground Noise Suppression in Low-Loss Glass Interposers Using a Double-Sided Electromagnetic Bandgap Structure

2020 ◽  
Vol 68 (12) ◽  
pp. 5055-5064
Author(s):  
Youngwoo Kim ◽  
Gapyeol Park ◽  
Kyungjun Cho ◽  
Pulugurtha Markondeya Raj ◽  
Rao R. Tummala ◽  
...  
2017 ◽  
Vol 59 (3) ◽  
pp. 940-951 ◽  
Author(s):  
Youngwoo Kim ◽  
Jonghyun Cho ◽  
Jonghoon J. Kim ◽  
Kyungjun Cho ◽  
Subin Kim ◽  
...  

Electronics ◽  
2022 ◽  
Vol 11 (2) ◽  
pp. 211
Author(s):  
Myunghoi Kim

In this paper, we present the impact of a meander-shaped defected ground structure (MDGS) on the slow-wave characteristics of a lowest-order passband and a low cutoff frequency of the first stopband of an electromagnetic bandgap (EBG) structure for power/ground noise suppression in high-speed integrated circuit packages and printed circuit boards (PCBs). A semi-analytical method is presented to rigorously analyze the MDGS effect. In the analytical method, a closed-form expression for a low cutoff frequency of the MDGS-EBG structure is extracted with an effective characteristic impedance and a slow-wave factor. The proposed analytical method enables the fast analysis of the MDGS-EBG structure so that it can be easily optimized. The analysis of the MDGS effect revealed that the low cutoff frequency increases up to approximately 19% while comparing weakly and strongly coupled MDGSs. It showed that the miniaturization of the MDGS-EBG structure can be achieved. It was experimentally verified that the low cutoff frequency is reduced from 2.54 GHz to 2.00 GHz by decreasing the MDGS coupling coefficient, which is associated with the miniaturization of the MDGS-EBG structure in high-speed packages and PCBs.


Author(s):  
Arpan Deyasi ◽  
Pampa Debnath ◽  
Siddhartha Bhattacharyya

Microwave photonics is the arena of research in the 21st century due to ever-increasing ultra-large bandwidth and the meticulous availability of data with very low cost. In this context, conventional optoelectronic devices are replaced by novel photonic counterparts, both in transreceiver design as well as devices and systems. The major objective of this replacement is to reduce noise by means of lower scattering, where photons are only responsible for propagation of electromagnetic wave. With introduction of novel materials, low-loss communication system can now be designed at beyond THz range, mainly due to the physical realization of electromagnetic bandgap structure. This chapter is extended towards plasmonics with the intension of making sensors for beyond THz applications.


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