Power Cycling Test Methods for Reliability Assessment of Power Device Modules in Respect to Temperature Stress

IEEE Transactions on Power Electronics ◽

10.1109/tpel.2017.2690500 ◽

2018 ◽

Vol 33 (3) ◽

pp. 2531-2551 ◽

Author(s):

Ui-Min Choi ◽

Frede Blaabjerg ◽

Soren Jorgensen

Keyword(s):

Temperature Stress ◽

Reliability Assessment ◽

Test Methods ◽

Power Device ◽

Cycling Test ◽

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Advanced Accelerated Power Cycling Test for Reliability Investigation of Power Device Modules

IEEE Transactions on Power Electronics ◽

10.1109/tpel.2016.2521899 ◽

2016 ◽

pp. 1-1 ◽

Author(s):

Ui-Min Choi ◽

Soeren Joergensen ◽

Frede Blaabjerg

Keyword(s):

Power Device ◽

Cycling Test ◽

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Real-time imaging of temperature distribution inside a power device under a power cycling test

Microelectronics Reliability ◽

10.1016/j.microrel.2017.06.092 ◽

2017 ◽

Vol 76-77 ◽

pp. 490-494 ◽

Author(s):

A. Watanabe ◽

R. Nagao ◽

I. Omura

Keyword(s):

Temperature Distribution ◽

Real Time ◽

Power Device ◽

Real Time Imaging ◽

Cycling Test ◽

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Thermal analysis and reliability assessment of power module under power cycling test using global- local finite element method

2014 9th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) ◽

10.1109/impact.2014.7048442 ◽

2014 ◽

Author(s):

Yi-Che Chiang ◽

Feng-Mao Hsu ◽

Yen-Fu Su ◽

Kuo-Ning Chiang

Keyword(s):

Finite Element Method ◽

Thermal Analysis ◽

Finite Element ◽

Reliability Assessment ◽

Power Module ◽

Cycling Test ◽

Power Cycling ◽

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Power cycling test of a 650 V discrete GaN-on-Si power device with a laminated packaging embedding technology

2017 IEEE Energy Conversion Congress and Exposition (ECCE) ◽

10.1109/ecce.2017.8096483 ◽

2017 ◽

Author(s):

Sungyoung Song ◽

Stig Munk-Nielsen ◽

Christian Uhrenfeldt ◽

Kjeld Pedersen

Keyword(s):

Power Device ◽

Cycling Test ◽

Power Cycling ◽

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Failure mechanism analysis of a discrete 650V enhancement mode GaN-on-Si power device with reverse conduction accelerated power cycling test

2017 IEEE Applied Power Electronics Conference and Exposition (APEC) ◽

10.1109/apec.2017.7930779 ◽

2017 ◽

Author(s):

Sungyoung Song ◽

Stig Munk-Nielsen ◽

Christian Uhrenfeldt ◽

Ionut Trintis

Keyword(s):

Failure Mechanism ◽

Power Device ◽

Mechanism Analysis ◽

Cycling Test ◽

Enhancement Mode ◽

Power Cycling ◽

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Failure mechanism analysis of off-state drain-to-source leakage current failure of a commercial 650 V discrete GaN-on-Si HEMT power device by accelerated power cycling test

Microelectronics Reliability ◽

10.1016/j.microrel.2017.07.011 ◽

2017 ◽

Vol 76-77 ◽

pp. 539-543 ◽

Author(s):

S. Song ◽

S. Munk-Nielsen ◽

C. Uhrenfeldt

Keyword(s):

Failure Mechanism ◽

Leakage Current ◽

Power Device ◽

Mechanism Analysis ◽

Cycling Test ◽

Power Cycling ◽

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Comparison of thermal stress concentration and profile between power cycling test and thermal cycling test for power device heat dissipation structures using Ag sintering chip-attachment

2016 International Conference on Electronics Packaging (ICEP) ◽

10.1109/icep.2016.7486906 ◽

2016 ◽

Author(s):

Kensuke Osonoe ◽

Takahiro Asai ◽

Masaaki Aoki ◽

Hitoshi Kida ◽

Nobuhiko Nakano

Keyword(s):

Thermal Stress ◽

Stress Concentration ◽

Thermal Cycling ◽

Heat Dissipation ◽

Power Device ◽

Thermal Cycling Test ◽

Cycling Test ◽

Power Cycling ◽

Thermal Stress Concentration ◽

Chip Attachment

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Adhesiveness evaluation of heat-resistance thermosetting imide molding plastic for SiC power device package with power cycling test

2016 6th Electronic System-Integration Technology Conference (ESTC) ◽

10.1109/estc.2016.7764472 ◽

2016 ◽

Author(s):

Akihiro Yasui ◽

Tsuyoshi Funaki ◽

Takuo Sugioka ◽

Satoshi Ogawa ◽

Teruhisa Fujibayashi

Keyword(s):

Heat Resistance ◽

Power Device ◽

Cycling Test ◽

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Development and power device reliability assessment of resonant pulsed power converters for RF applications

IET Conference on High Power RF Technologies ◽

10.1049/cp.2009.0009 ◽

2009 ◽

Author(s):

F. Carastro ◽

J.C. Clare ◽

M.J. Bland ◽

C.M. Johnson ◽

P.W. Wheeler

Keyword(s):

Power Converters ◽

Reliability Assessment ◽

Pulsed Power ◽

Power Device ◽

Device Reliability ◽

Rf Applications

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Board Level Solder Joint Reliability Assessment Study of Megtron 6 Vs FR-4 Under Power Cycling and Thermal Cycling

2018 17th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) ◽

10.1109/itherm.2018.8419505 ◽

2018 ◽

Author(s):

Jyotirmoy Denria ◽

Pavan Rajmane ◽

Dereje Agonafer

Keyword(s):

Solder Joint ◽

Thermal Cycling ◽

Reliability Assessment ◽

Solder Joint Reliability ◽

Joint Reliability ◽

Assessment Study ◽

Power Cycling ◽

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