A Simple Model for Calculating Transformer Hot-Spot Temperature

2009 ◽  
Vol 24 (3) ◽  
pp. 1257-1265 ◽  
Author(s):  
Dejan Susa ◽  
Hasse Nordman
Author(s):  
Horacio Nochetto ◽  
Peng Wang ◽  
Avram Bar-Cohen

Driven by shrinking feature sizes, microprocessor hot spots have emerged as the primary driver for on-chip cooling of today’s IC technologies. Current thermal management technologies offer few choices for such on-chip hot spot remediation. A solid state germanium self-cooling layer, fabricated on top of the silicon chip, is proposed and demonstrated to have great promise for reducing the severity of on-chip hot spots. 3D thermo-electrical coupled simulations are used to investigate the effectiveness of a bi-layer device containing a germanium self-cooling layer above an electrically insulated silicon layer. The parametric variables of applied current, cooler size, silicon percentage, and total die thickness are sequentially optimized for the lowest hot spot temperature compared to a non-self-cooled silicon chip. Results suggest that the localized self-cooling of the germanium layer coupled with the higher thermal conductivity of the silicon chip can significantly reduce the temperature rise resulting from a micro-scaled hot spot.


Author(s):  
Yeong-Ley Tsay ◽  
Jen-Chieh Cheng ◽  
Yong-Lin Zhuang

A numerical analysis is performed to study the characteristics of heat transfer from a block heat source module at different angles in two-dimensional cabinets. Great efforts are carried out to conduct the effects of thermal interaction between the air steams inside and outside the cabinet on the conjugate conduction–natural convection phenomena. Moreover, the enhancement of cooling performance of the heat source module through the construction of air vents on cabinet wall is rigorously examined. The computation domain covers the cabinet and the surrounding area, and the temperature and velocity fields of the cabinet and surrounding area are solved simultaneously. Results show that the thermal interaction between the airs inside and outside the cabinet, the module angle and vent position can significantly affect the transfer characteristics. Comparing the results for cases with and without the consideration of thermal interaction between the air streams, the difference in hot spot temperature of module can be up to 26% for Pr = 0.7, Kbf = Kpf = Kwf = 100, 105 ≦ Ra ≦ 107 and φ = 0°, 90°, 270°. The maximum reduction in hot spot temperature is about 41% when two air vents are constructed on cabinet wall. The variation of module angle results in the maximum difference of the hot spot temperature is 15% for closed cabinet, and 10% for ventilated cabinet.


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